Photosensitive Chip Packaging With Thin Protective Layer
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Solution Overview
Problem
Conventional semiconductor packaging methods using transparent glass covers for photosensitive chip regions suffer from light refraction, reflection, and energy loss, as well as adhesive detachment issues that allow dust to enter, affecting the chip's photosensitive performance.
Innovation Solution
A semiconductor packaging method involving a chip with a transparent protective layer directly formed on the chip substrate, covering the photosensitive region and a metal part, where the metal part's end is exposed and electrically connected to a circuit board using a conductive connection part, such as a wire or conductive folded plate, to reduce thickness-related issues and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent glass cover is added above the photosensitive region to protect it, then the photosensitive region is protected, but light refraction, reflection, and energy loss occur, degrading photosensitive effect
Solution Approach 1:
The patent changes the thickness parameter of the transparent protective layer from conventional thick glass to a thin layer (1-10 micrometers). This parameter change reduces light refraction, reflection, and energy loss while maintaining protection function. The thin transparent layer is formed by spin coating or dispensing a transparent material and solidifying it, creating an ultra-thin protective structure that minimizes optical interference.
Solution Approach 2:
The patent employs a thin transparent protective layer instead of conventional thick glass covers. This thin film structure (1-10 micrometers thick) provides protection while allowing light to pass through with minimal refraction, reflection, or energy loss. The thin film is applied directly to the chip substrate and cured to form a durable protective coating that maintains optical performance.
2Reliability
If a transparent glass cover is used to protect the photosensitive region, then protection is provided, but the adhesive connection may detach after long use, allowing dust to enter and affect photosensitive effect
Solution Approach 1:
The patent merges the transparent protective layer directly with the chip substrate by forming the layer in situ through spin coating or dispensing, followed by solidification. This integration eliminates the need for separate adhesive connections between glass cover and chip, preventing adhesive detachment and dust intrusion over time. The protective layer becomes an integral part of the chip structure, ensuring long-term reliability.
Solution Approach 2:
The patent uses a transparent material layer as an intermediary substance that is applied and solidified to form a bonded protective structure. This intermediary layer (formed by spin coating or dispensing) creates a strong bond between the protective function and the chip substrate without requiring additional adhesives, eliminating the dust intrusion problem associated with adhesive failure.
3Loss of energy
If the transparent protective layer is made thin to reduce light refraction and reflection, then photosensitive effect is improved, but the protective function may be compromised
Solution Approach 1:
The patent uses composite material structures where a thin transparent protective layer (1-10 micrometers) is formed on the chip substrate. This thin layer provides optical transparency with minimal refraction and reflection, while the composite structure of the layer plus substrate provides the necessary mechanical strength and protection. The transparent material is cured to form a durable thin-film composite that balances optical performance with protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces light refraction and reflection, improves the photosensitive effect, and minimizes the risk of dust contamination by controlling the transparent protective layer's thickness and ensuring a secure connection, thus enhancing the chip's performance and reliability.
Implementation Method 1
forming the transparent protective layer on the front surface of the chip substrate by spin coating, dispensing or printing a material, and solidifying the material for the transparent protective layer
Implementation Method 2
solidifying the material for the transparent protective layer using ultraviolet irradiation or high-temperature baking
Implementation Method 3
refraction, reflection, energy loss and the like may occur when light passes through the transparent glass
Implementation Method 4
refraction, reflection, energy loss and the like may occur when light passes through the transparent glass
Data Source
AI summary
The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads disposed at the front surface of a chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. A first end of the metal part away from a corresponding soldering pad is in coplanar with the transparent protective layer; and the first end of the metal part is not covered by the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.