Photosensitive Composition for Low-CTE High-Tg Package Patterns
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Solution Overview
Problem
Existing photosensitive compositions used in forming patterns for semiconductor packages exhibit high coefficients of thermal expansion (CTE) and low glass transition temperatures (Tg), which are undesirable for reliable performance in display devices with touch panels.
Innovation Solution
A photosensitive composition comprising a compound A with a carboxy group, a compound β that reduces the carboxy group content upon exposure, and a filler, specifically designed to form patterns with low CTE and high Tg, is developed. The composition includes compounds like acridine and silicon dioxide, with optimized mass ratios and particle sizes to enhance pattern formability and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive composition is used, then pattern formation is achieved, but the pattern exhibits high CTE and low Tg
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive material by incorporating specific resins (polyester, acrylic, vinyl) with defined functional groups and ratios, along with catalysts and solvents in optimized concentrations, to achieve patterns with high Tg and low CTE that meet reliability requirements for display devices
Solution Approach 2:
The patent creates a composite photosensitive composition combining multiple resin types (polyester resin, acrylic resin, vinyl resin) with catalysts, solvents, and other additives in specific ratios, forming a multi-component system that achieves both low CTE and high Tg properties in the cured pattern
2Reliability
If conventional photosensitive composition is used, then pattern formation is achieved, but the pattern exhibits high CTE
Solution Approach 1:
The patent modifies the thermal expansion characteristics by adjusting the chemical composition parameters, specifically using resins with low thermal expansion coefficients and optimizing the ratio of polyester, acrylic, and vinyl resins to achieve patterns with CTE of 30 ppm/K or less at match with glass substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces the CTE and increases the Tg of formed patterns, leading to improved reliability and performance in semiconductor packages and display devices with touch panels.
Implementation Method 1
a compound β having a structure in which an amount of the carboxy group included in the compound A is decreased by exposure
Implementation Method 2
the compound β is a compound B having a structure capable of accepting an electron from the carboxy group included in the compound A in a photoexcited state
Data Source
AI summary
An object of the present invention is to provide a photosensitive composition capable of forming a pattern having a low coefficient of thermal expansion and a high glass transition temperature; a transfer film; a cured film; a semiconductor package; a pattern forming method; and a manufacturing method of a semiconductor package. The photosensitive composition of the present invention contains a compound A having a carboxy group, a compound β having a structure in which an amount of the carboxy group included in the compound A is decreased by exposure, and a filler.