Photosensitive Element Flat Interface Manufacturing Method

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Solution Overview

Problem

The issue of poor imaging quality in photosensitive elements due to damage at the interface of the photosensitive layer, which affects fingerprint recognition and display quality in multifunctional electronic devices.

Innovation Solution

A manufacturing method involving successive deposition of a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate, followed by patterning and insulation to form a photosensitive element with a silicon-rich oxide layer, ensuring a flat interface between the bottom electrode and the photosensitive layer, and electrical connection between top electrodes, thereby reducing interface damage and improving imaging quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing methods are used to form the photosensitive layer, then the manufacturing process is simple, but the interface between the bottom electrode and photosensitive layer becomes damaged causing poor imaging quality

Engineering Contradiction:

Improveinterface flatnessVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the photosensitive layer before patterning the top electrode, ensuring the interface is established in its optimal state before subsequent processing steps. The photosensitive material layer is deposited and planarized first, then the electrode pattern is formed on top, preventing interface damage that would occur if electrode patterning were performed first

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The manufacturing process is segmented into distinct sequential steps: first forming the photosensitive material layer with controlled deposition, then planarizing the surface, and finally patterning the top electrode. This segmentation allows each step to be optimized independently, ensuring interface quality without compromising overall process feasibility

Inventive Principle:

Principle #1Segmentation

2Reliability

If the photosensitive layer interface is damaged, then manufacturing is easier, but imaging quality deteriorates affecting fingerprint recognition

Engineering Contradiction:

Improveimaging qualityVSAvoidinterface protection complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The photosensitive layer is formed and planarized before electrode patterning, establishing a protected interface early in the process. This preliminary formation ensures the interface remains intact throughout subsequent manufacturing steps, improving reliability without adding significant manufacturing complexity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary planarization layer or process step between electrode deposition and photosensitive layer formation, which protects the interface during manufacturing. This intermediary structure ensures the interface remains undamaged while maintaining ease of manufacture

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances the imaging quality of photosensitive elements, improving fingerprint recognition and display quality by minimizing interface damage and ensuring a flat interface between layers, thus increasing the overall performance of the electronic device.

Implementation Method 1

A second conductive layer, a photosensitive material layer, and a first top electrode material layer are successively deposited on a substrate

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS11227874B2Photosensitive element having substantially flat interface between electrode and photosensitive layer and manufacturing method thereof

Publication Date: 2022.01.18 AU OPTRONICS CORP

AI summary

A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.