Photosensitive Polyimide Composition for Chemical Resistance
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Solution Overview
Problem
Conventional photosensitive polyimide resins used in semiconductor manufacturing lack chemical resistance, making them susceptible to damage in acid/alkaline environments during subsequent processes.
Innovation Solution
A positive photosensitive resin composition comprising a polyimide resin with specific structural units, quinonediazide sulfonate as a sensitizer, a thermal curing agent (such as epoxy and melamine compounds), and a thermal acid generator (like onium sulfonium salts) is developed, which provides both heat and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimide resin is used, then heat resistance and mechanical properties are improved, but chemical resistance deteriorates
Solution Approach 1:
The patent applies composite materials by combining polyimide resin with silane-modified components and curing agents to create a photosensitive composition that exhibits both heat resistance (from polyimide) and chemical resistance (from silane crosslinked network), resolving the contradiction between these two properties
Solution Approach 2:
The patent changes the chemical structure parameters of the polyimide resin by introducing silane groups and reactive functional groups that can form crosslinked networks upon curing, thereby transforming the material from chemically vulnerable to chemically resistant while preserving thermal stability
2Stability of the object's composition
If polyimide resin is used as insulating layer, then dimensional stability is improved, but susceptibility to acid/alkaline damage increases
Solution Approach 1:
The patent applies preliminary action by incorporating silane-modified components and curing agents into the photosensitive composition before application, which upon curing form a protective crosslinked network that preemptively protects the polyimide resin from subsequent acid/alkaline damage during semiconductor manufacturing processes
Solution Approach 2:
The invention creates a composite photosensitive composition where silane-modified polymers and curing agents work synergistically with polyimide resin to provide both dimensional stability and resistance to chemical etchants
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent chemical resistance and insulating properties, suitable for semiconductor manufacturing, with improved film retention and electrical characteristics, enhancing process efficiency and reducing costs.
Implementation Method 1
a quinonediazide sulfonate
Implementation Method 2
a thermal acid generator
Implementation Method 3
the thermal curing agent may include an epoxy compound and a melamine compound
Data Source
AI summary
The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator.In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.