Negative Photosensitive Polyimide Resin for Low-Temperature Patterning

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Solution Overview

Problem

Existing photosensitive resin compositions using polyimide precursors face challenges in achieving low-temperature imide ring closure reactions, storage stability, and the formation of fine patterns with sufficient chemical resistance and mechanical properties, particularly in high-density packaging technologies.

Innovation Solution

A negative photosensitive resin composition incorporating a polymer compound with a polyimide precursor structure, a photoinitiator, a nitrogen-containing organic compound, and a solvent, which facilitates imide ring closure at 200°C or lower, enhances storage stability, and forms a cured film with high chemical resistance and glass transition temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If imidization treatment is performed at high temperature exceeding 300°C to obtain desired polyimide film, then the insulation property and mechanical strength are improved, but the underlayer base material is limited, copper wiring oxidizes, and thermal damage to electronic components occurs

Engineering Contradiction:

Improvemechanical strengthVSAvoidthermal damage

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the temperature parameter from conventional high temperature (exceeding 300°C) to low temperature (200°C or lower) by introducing a thermal base generator that produces a base at low temperature, enabling imide ring closure reaction without thermal damage to underlying components

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces a thermal base generator as an intermediary substance that decomposes at low temperature to generate a base, which then facilitates the imide ring closure reaction without requiring direct high-temperature treatment, thus protecting underlying copper wiring and electronic components

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If thermal base generator that generates base by heat decomposition at 200°C or lower is used to facilitate imide ring closure reaction, then low-temperature treatment is achieved, but corrosion resistance and chemical resistance of cured film deteriorate

Engineering Contradiction:

Improvecuring temperatureVSAvoidchemical resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent creates a composite system combining a polyimide precursor, thermal base generator, and solvent in specific proportions, where the synergistic interaction maintains chemical resistance even at low curing temperatures, achieving both low-temperature processing and reliable chemical resistance

Inventive Principle:

Principle #40Composite materials

3Stability of the object's composition

If polyimide precursor composition is stored, then cyclization reaction proceeds during storage resulting in gelation, but adding imidazoles as imidization catalyst causes storage instability and gelation

Engineering Contradiction:

Improvestorage stabilityVSAvoidcomposition stability

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The patent optimizes the concentration parameters of the thermal base generator and solvent to maintain composition stability during storage, preventing premature gelation while enabling low-temperature imidization when needed, achieving both storage stability and reactivity on demand

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables low-temperature curing without pattern deformation, maintains storage stability, and produces a cured film with excellent chemical resistance and high glass transition temperature, suitable for interlayer insulating and surface protective films.

Implementation Method 1

a photopolymerization initiator (C)

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

a nitrogen-containing organic compound (D) which has a structure represented by general formula (1)... undergoes thermal decomposition when heated at a temperature of 200° C. or lower to generate secondary amine

Methodology Applied

Scientific EffectThermal decomposition: Thermolysis

Implementation Method 3

the secondary amine generated by thermal decomposition facilitates imide ring closure reaction

Methodology Applied

Scientific EffectCatalysis: Catalysis

Data Source

PatentUS20260104641A1Negative photosensitive resin composition, patterning process method for forming cured film, interlayer insulating film, surface protective film, and electronic component

Publication Date: 2026.04.16 SHIN ETSU CHEMICAL CO LTD

AI summary

The present invention is a negative photosensitive resin composition includes: (A) a polymer compound having a polyimide precursor structure; (C) a photoinitiator; (D) a nitrogen-containing organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition using a polyimide precursor, which enables imide ring closure reaction to be performed at low temperature, has excellent stability of the composition, and is capable of forming a fine pattern and providing resistance to chemicals. Additionally, a patterning process using the photosensitive resin composition, an interlayer insulating film characterized by including a cured film of a photosensitive resin composition, and an electronic component are to be provided.