See how periodic micro-nano structures on polymer film surfaces control infrared emissivity to
Automated melting, filtering, coating, lamination, and hot-air cutting improve DFR film uniformity, clean edges, and production throughput.
UV photolithography keeps coating only in inter-chip spaces, exposing chip front faces while avoiding heat and abrasion damage to fragile chips.
A protective element on the lens tip blocks resin contact and contamination while preserving short beam paths for precise 3D polymerization.
Simulated semiconductor process data trains analysis models faster, cutting real data collection time and cost while preserving accuracy.
Independent elastic link assemblies keep wafer and stamp parallel, spreading load to avoid hinge stress and improve imprint yield.
Pre-adjusting the laser optical module at an inspection port enables uniform mask heating and more accurate critical dimension correction.