Photosensitive Polyimide Composition for Storage-Stable Low-Loss Films
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Solution Overview
Problem
Existing photosensitive resin compositions used to form polyimide films exhibit a low dielectric loss tangent but suffer from stability issues during storage, leading to changes in viscosity.
Innovation Solution
A photosensitive resin composition comprising a polyimide resin precursor with specific structural units, a photoradical polymerization initiating agent, and an organic solvent, particularly using a urea solvent in a 50% by mass proportion, to stabilize the composition and form a polyimide resin with a low dielectric loss tangent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a photosensitive resin composition including an aromatic polyamide resin with a 4,4′-dioxybiphenyl skeleton is used, then the dielectric loss tangent is reduced, but the viscosity increases during storage
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide resin precursor by introducing specific side chain structures (formula 1) with controlled carbon atom numbers and functional groups. This structural modification allows the resin to maintain low dielectric loss tangent while improving storage stability by preventing excessive viscosity increase
Solution Approach 2:
The patent creates a composite photosensitive resin composition by combining the specially structured polyimide resin precursor (A) with specific photopolymerization initiating agents (C) and organic solvents (S) in defined proportions. This composite formulation achieves both low dielectric loss and improved storage stability through synergistic effects of the components
2Loss of energy
If the dielectric constant and dielectric loss tangent are reduced for high-frequency applications, then the transmission loss is decreased, but the resin composition becomes less stable during storage
Solution Approach 1:
The patent modifies the molecular structure parameters of the polyimide resin precursor by incorporating specific side chain configurations (formula 1) that optimize the balance between dielectric properties and storage stability, enabling low transmission loss while maintaining composition reliability
Solution Approach 2:
The patent introduces specific local structural features (side chains with formula 1) into the polyimide resin precursor that locally modify the material properties. These localized structural modifications create regions with optimized dielectric characteristics while simultaneously improving overall storage stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a polyimide resin with improved stability during storage and forms a patterned resin film with low dielectric loss tangent, suitable for high-frequency applications.
Implementation Method 1
a photoradical polymerization initiating agent (C)
Data Source
AI summary
A photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin film using the photosensitive resin composition; and a method for producing a patterned polyimide resin film by using the photosensitive resin composition. This photosensitive resin composition includes a polyimide resin precursor derived from a dicarboxylic acid compound that has an unsaturated group including a carbon-carbon double bond, and a diamine compound that has, in a side chain, an aromatic group and/or a diamine compound that has a 4,4′-dioxybiphenyl skeleton; a photo-radical polymerization initiator; and an organic solvent. A certain amount of a urea-based solvent is used as the organic solvent.