Positive Photosensitive Insulating Resin Composition for Pattern Shape Stability
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Solution Overview
Problem
Conventional positive photosensitive resin compositions used in electronic components face issues such as pattern shape changes before and after post-baking, along with limitations in resolution, electrical insulation, thermal shock resistance, and adhesion, making them unsuitable for practical industrial applications.
Innovation Solution
A positive photosensitive insulating resin composition comprising an alkali soluble resin, a compound with a quinonediazide group, and an epoxy resin with a softening point of not lower than 30°C, optionally including crosslinked fine particles, is developed to reduce pattern shape changes and enhance performance in resolution, electrical insulation, and thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional positive photosensitive resin compositions are used, then photosensitivity is achieved, but pattern shape changes occur before and after post-baking
Solution Approach 1:
The patent changes the chemical composition parameters by using specific epoxy resins with softening points of 0°C or lower (such as glycidyl ether of polybutadiene, glycidyl ether of polyisoprene) instead of conventional epoxy resins with higher softening points. This parameter change prevents pattern shape changes during post-baking while maintaining photosensitivity through the quinonediazide compound system.
2Manufacturing precision
If epoxy resin with low softening point is used, then pattern shape stability is improved, but adhesion and mechanical properties may deteriorate
Solution Approach 1:
The patent creates a composite resin composition combining alkali-soluble resin (novolak or phenolic resin), quinonediazide compound, and specific low softening point epoxy resin. This composite material achieves both pattern shape stability and adequate adhesion/mechanical properties through synergistic interactions among components, with the epoxy resin providing shape stability and the alkali-soluble resin contributing to adhesion.
3Ease of operation
If conventional resin systems are used, then ease of handling is maintained, but resolution and electrical insulation are insufficient
Solution Approach 1:
The patent changes the chemical structure parameters of the epoxy resin to have softening points of 0°C or lower, which enables better resolution and electrical insulation properties. The specific choice of epoxy resins (glycidyl ether of polybutadiene, glycidyl ether of polyisoprene) provides both improved manufacturing precision and maintains ease of handling through appropriate viscosity and processing characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves reduced pattern shape changes and improved performance in resolution, electrical insulation, and thermal shock resistance, making it suitable for use as an interlayer insulation film, passivation film, or overcoat film in electronic components like printed circuit boards and semiconductor devices.
Implementation Method 1
a compound (B) having a quinonediazide group
Implementation Method 2
an epoxy resin (C) having a softening point of not lower than 30° C., and a compound generating a curing catalyst
Data Source
AI summary
Disclosed is a positive photosensitive insulating resin composition including:(A) an alkali soluble resin,(B) a compound having a quinonediazide group, and(C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition.The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.