Diazo Compound Compositions TRIZ Cases
- Positive-Type Photosensitive Resin Composition for Low-Temperature Curing
A polyamide-based photosensitive resin composition cures at low temperatures to form reliable insulating films.
- Siloxane Polymer Interlayer Insulating Film Composition
A positive-type radiation-sensitive composition uses a siloxane polymer with controlled aryl groups to form interlayer insulating films.
- Polyimide Resin Composition for Semiconductor Buffer Coating
A polyimide-based photosensitive resin composition with controlled molecular weight and glass transition temperature.
- Positive Photosensitive Insulating Resin Composition for Pattern Shape Stability
A positive photosensitive insulating resin composition reduces pattern shape changes during post-baking through specific epoxy resin selection.
- Calix Resorcinarene Resist Composition for Fine Patterning
A calix resorcinarene derivative composition with hydrophobic substituents enhances pattern resolution and sensitivity in negative-working resist systems.
- Amine-Treated Maleic Anhydride Norbornene Copolymers for Low-k Films
Amine ring-opening of maleic anhydride units creates stable imide structures that resolve thermal stability and photoimaging trade-offs.
- Photosensitive Polybenzoxazole Precursor Sidewall Angle Control
A photosensitive polybenzoxazole composition incorporates a plasticizer to modify cured film geometry.
- Photosensitive Resin Composition for LCD Spacer Resolution
A photosensitive resin composition forms spacers with enhanced resolution and development adherence.
- Novolac Photoresist Composition for KrF Lithography
Novolac photoresist composition with low molecular substance increases light transmissivity at short wavelengths.
- Photosensitive Polyimide Resin for Copper Wiring Corrosion
A photosensitive polyimide resin composition prevents copper corrosion while maintaining film adhesion.