Positive-Type Photosensitive Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
Existing positive-type photosensitive resin compositions used for semiconductor devices face challenges such as damage from high curing temperatures, low glass transition temperature, and susceptibility to cracking due to fillers, which affect the reliability of insulating and protective films.
Innovation Solution
A positive-type photosensitive resin composition comprising a polyamide resin with specific structural units and a photosensitive compound, capable of being cured at low temperatures, achieving a tensile modulus of elasticity of 2.0 to 4.0 GPa and a glass transition temperature of 230 to 400°C, thereby preventing cracks and ensuring reliable film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the positive-type photosensitive resin composition is cured at a high temperature, then the crosslinking reaction is complete and the film has good adhesion, but the wires of the semiconductor element may be damaged due to heat
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by using a specific combination of polyamide resin with carboxyl groups and cyclic carbonate crosslinking agents, which enables the curing reaction to proceed effectively at lower temperatures (200-250°C) while maintaining complete crosslinking and good adhesion properties
2Object-affected harmful factors
If the positive-type photosensitive resin composition is cured at a low temperature, then the wires are protected from heat damage, but the cured film has poor properties (low glass transition temperature and low modulus of elasticity)
Solution Approach 1:
The patent creates a composite curing system combining polyamide resin with specific carboxyl group content and cyclic carbonate crosslinking agents, forming a crosslinked network structure that achieves both low curing temperature and high mechanical properties including elevated glass transition temperature (200-400°C) and modulus of elasticity (3.0-6.0 GPa)
Solution Approach 2:
The patent optimizes the chemical parameters including carboxyl group content (0.1-5.0 mmol/g), molecular weight (5,000-100,000), and crosslinking agent ratio to achieve a cured film with glass transition temperature of 200-400°C and modulus of elasticity of 3.0-6.0 GPa, maintaining high strength at low curing temperatures
3Temperature
If the cured positive-type photosensitive resin composition has a low glass transition temperature and low modulus of elasticity, then the curing temperature can be reduced, but cracks may occur in the insulating film or protective film due to filler in encapsulation resin
Solution Approach 1:
The patent develops a composite resin system with polyamide resin and cyclic carbonate crosslinking agents that produces a cured film with high glass transition temperature (200-400°C) and high modulus of elasticity (3.0-6.0 GPa), providing sufficient mechanical strength to resist cracking from filler expansion during encapsulation while maintaining low curing temperature
Solution Approach 2:
The patent adjusts the physical parameters of the cured film including glass transition temperature (200-400°C), modulus of elasticity (3.0-6.0 GPa), and crosslinking density to achieve optimal crack resistance against filler-induced stress during encapsulation processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of highly reliable insulating and protective films for semiconductor devices, preventing cracks and delamination, and maintaining adhesion during high-temperature processes, while ensuring excellent patterning capability and chemical resistance.
Implementation Method 1
a photoacid generator, and a crosslinking agent has been used
Implementation Method 2
positive-type photosensitive resin composition comprising (A) a polyamide resin and (B) a photosensitive compound
Data Source
AI summary
A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%.According to the present invention, a positive-type photosensitive resin composition that can be cured at a low temperature and a highly reliable semiconductor device including a cured film of the positive-type photosensitive resin composition can be provided.