Polyimide Resin Composition for Semiconductor Buffer Coating
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Solution Overview
Problem
Existing polyimide-based photosensitive resin compositions face challenges in achieving high resolution, sensitivity, and mechanical physical properties, particularly in semiconductor applications, due to issues such as reduced film quality and alkali-proof property deterioration during development.
Innovation Solution
A polyimide-based positive-type photosensitive resin composition is developed, incorporating a polyimide with specific structural features, a polyamic acid, a novolak resin, and a photoactive compound, optimized in terms of molecular weight, glass transition temperature, and composition ratio to enhance resolution, sensitivity, and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyamic acid is used as a binder resin, then alkali solubility is improved, but film reduction occurs during development
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide by incorporating specific diamine components (Y1 and Y2 groups) and controlling the repetition units (a and b) to achieve optimal alkali solubility without film reduction. The molecular weight and glass transition temperature are also controlled within specific ranges to resolve the contradiction.
Solution Approach 2:
The patent creates a composite photosensitive resin composition by combining polyimide with specific additives and controlling the composition ratio of multiple components, including the use of novolak resin and other auxiliary agents, to achieve both good alkali solubility and film integrity.
2Manufacturing precision
If polyimide with acid groups in branched chain is used, then resolution is improved, but alkali-proof property deteriorates
Solution Approach 1:
The patent modifies the polyimide structure by controlling the repetition units (a and b) and the types of diamine components (Y1 and Y2) to balance resolution and alkali-proof properties. The specific structural parameters are optimized to prevent acid groups from remaining in the polymer after hardening.
Solution Approach 2:
The patent introduces specific functional groups (Y1 containing phenolic hydroxyl, carboxyl, or hydroxyl radicals) at specific locations in the polymer chain to provide local alkali solubility enhancement without compromising the overall alkali-proof property and resolution.
3Use of energy by moving object
If crosslinkable function group is added to polyimide precursor, then photosensitivity is improved, but mechanical properties deteriorate
Solution Approach 1:
The patent optimizes the molecular weight (1,000 to 100,000) and glass transition temperature (200 to 400°C) of the polyimide to maintain good mechanical properties while incorporating crosslinkable function groups. The specific structural parameters (repetition units a and b) are controlled to balance photosensitivity and mechanical strength.
4Strength
If high molecular weight polyimide is used, then mechanical strength is improved, but solubility and processability worsen
Solution Approach 1:
The patent specifies a molecular weight range (1,000 to 100,000) and controls the repetition units (a and b) to achieve optimal balance between mechanical strength and solubility. The glass transition temperature is also controlled within 200 to 400°C to ensure proper processability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high resolution, sensitivity, and excellent mechanical physical properties, suitable for semiconductor buffer coating, with improved film characteristics and alkali-solubility, facilitating the formation of fine patterns and reliable semiconductor devices.
Implementation Method 1
the polyimide has an i-ray permeability of 70% or more
Implementation Method 2
a photoactive compound
Data Source
AI summary
The present invention provides polyimide applied to the buffer coating of semiconductors and a photosensitive resin composition including the same. The polyimide is a polyimide polymer represented by Chemical Formula 1 below. Further, the present invention provides a photosensitive resin composition, including 1) BDA-series soluble polyimide having an i-ray permeability of 70% or more; 2) a polyamic acid having elongation of 40% or more; 3) a novolak resin, and 4) diazonaphthoquinone-series photosensitive substance and having a high resolution, high sensitivity, an excellent film characteristic, and mechanical physical properties which are the requirements of semiconductor buffer coating.