Photosensitive Polyimide Resin for Copper Wiring Corrosion
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Solution Overview
Problem
Conventional polyimide-based and polybenzoxazole precursor resins used in semiconductor manufacturing corrode copper and copper alloys, leading to issues like poor insulation, wire breaking, short circuits, rust, reduced film adhesiveness, and deterioration of physical properties due to reactive acid functional groups, which are not adequately addressed by existing solutions.
Innovation Solution
A positive-type photosensitive resin composition containing a polybenzoxazole precursor, a solvent, a tetrazole derivative, and a light-generated acid compound, which provides excellent film adhesion and resistance to corrosion on copper and copper alloys, especially under harsh conditions, while preventing residual films and ensuring high sensitivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide-based resin or polybenzoxazole precursor resin is used to form interlayer insulation films or surface protective films, then heat resistance and film formation capability are improved, but corrosive action on copper and copper alloys occurs due to carboxyl groups in polyamic acid structure, leading to poor insulation, wire breaking, short circuits, and rust
Solution Approach 1:
The patent removes the harmful carboxyl groups from the polyamic acid structure by using polyimide resin that has already been imidized (converted to polyimide structure) as the base resin. This extraction of the harmful functional group eliminates the corrosive action on copper while preserving the heat resistance properties of the polyimide structure.
Solution Approach 2:
The patent changes the chemical structure parameter from polyamic acid (with carboxyl groups) to polyimide (with imide rings), fundamentally altering the chemical properties to eliminate corrosion while maintaining thermal stability. This parameter change transforms the resin from corrosive to non-corrosive.
2Object-generated harmful factors
If 1H-tetrazole or its derivative is contained in polyimide-based resin to prevent corrosive action, then corrosion resistance is improved, but adhesiveness under harsh conditions such as heating and applying pressure is not sufficiently ameliorated
Solution Approach 1:
The patent introduces a coupling agent as an intermediary substance that mediates between the polyimide resin and the copper substrate. The coupling agent provides both corrosion protection (replacing tetrazole's function) and enhanced adhesion (improving upon tetrazole's deficiency), creating a beneficial interface layer.
Solution Approach 2:
The patent creates a composite resin composition by combining polyimide resin with a coupling agent. This composite material integrates the heat resistance of polyimide with the adhesion enhancement and corrosion protection properties of the coupling agent, achieving multiple functions simultaneously.
3Manufacturing precision
If polybenzoxazole precursor resin is used as base resin, then photosensitivity and pattern formation capability are improved, but corrosive action on copper and copper alloys occurs similarly to polyimide precursor due to phenolic hydroxyl groups
Solution Approach 1:
The patent removes the harmful phenolic hydroxyl groups by selecting polyimide resin (already imidized) as the base resin instead of polybenzoxazole precursor resin. This extraction eliminates the corrosive functionality while preserving the photosensitivity and pattern formation capabilities through the use of photoresist components.
Solution Approach 2:
The patent creates a composite system combining polyimide resin with photoresist components (photosensitive compounds, solvents, and additives). This composite maintains the pattern formation capability of photosensitive resins while eliminating their corrosive effects on copper substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves superior film adhesion and resistance to corrosion on copper and copper alloys, ensuring high reliability and sensitivity, with improved pattern resolution and heat resistance, effectively addressing the limitations of existing resin compositions.
Implementation Method 1
a compound (D) which generates acid by light
Implementation Method 2
containing a polybenzoxazole precursor (A), a solvent (B), a tetrazole derivative (C), and a compound (D) which generates acid by light
Data Source
AI summary
A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I):wherein X represents a bivalent organic group, Y represents a tetravalent organic group, R1 represents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.