Photosensitive Resin Composition for Fine Pattern Resolution and Thermal Shock Resistance
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Solution Overview
Problem
The existing photosensitive resin compositions used in printed wiring boards face challenges in forming fine patterns and achieving thermal shock resistance, often resulting in insufficient resolution, hemming, undercut formation, and cracking of the permanent resist.
Innovation Solution
A photosensitive resin composition comprising an acid-modified vinyl group-containing resin, a thermosetting resin, a photopolymerization initiator, and a photopolymerizable compound with a polyoxyalkylene chain and ethylenically unsaturated group, which improves resolution and pattern forming properties while enhancing thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive resin composition is used, then mass production is achieved through photography, but resolution is insufficient and hemming occurs in fine pattern formation
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive resin by incorporating specific components: acid-modified vinyl group-containing resin (A) with carboxyl groups, thermosetting resin (B), and photopolymerizable compounds (D) with polyoxyalkylene chains. These parameter changes in resin composition enable high-resolution patterning while preventing hemming defects, resolving the contradiction between precision and productivity.
Solution Approach 2:
The invention uses a composite photosensitive resin system combining multiple resin types (acid-modified vinyl resin, thermosetting resin) with photopolymerization initiators and specific photopolymerizable compounds. This composite material approach leverages the complementary properties of each component to achieve both fine pattern resolution and defect-free formation, enabling high-quality mass production through photography.
2Ease of manufacture
If conventional photosensitive resin composition is used, then photography process is simple, but undercut shape forms excessively around opening
Solution Approach 1:
The patent adjusts the chemical parameters of the photosensitive resin by incorporating acid-modified vinyl group-containing resin with specific carboxyl group content and photopolymerizable compounds with polyoxyalkylene chains. These parameter modifications control the development behavior and etching resistance, preventing excessive undercut formation while maintaining the simplicity of the photography process.
3Reliability
If conventional permanent resist is used, then solder resist function is provided, but thermal shock resistance is insufficient
Solution Approach 1:
The invention employs a composite resin system where acid-modified vinyl group-containing resin (A) provides adhesion and flexibility, thermosetting resin (B) provides thermal stability, and photopolymerizable compounds (D) with polyoxyalkylene chains provide toughness and crack resistance. This composite structure enables the permanent resist to withstand thermal shock without cracking while maintaining solder resist functionality.
Solution Approach 2:
The patent modifies the thermal and mechanical parameters of the permanent resist by selecting specific resin components with appropriate glass transition temperatures, crosslinking densities, and molecular structures. These parameter changes enhance thermal shock resistance and prevent crack formation under thermal stress while preserving the solder resist function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed composition enables the formation of a permanent resist with improved resolution and thermal shock resistance, addressing the limitations of existing technologies by providing better pattern fidelity and reliability in printed wiring boards.
Implementation Method 1
the photosensitive resin composition is applied and dried, and then, is selectively irradiated with an active light ray such as an ultraviolet ray, and is cured
Data Source
AI summary
A photosensitive resin composition according to the present disclosure, contains an acid-modified vinyl group-containing resin (A), a thermosetting resin (B), a photopolymerization initiator (C), and a photopolymerizable compound (D), in which the photopolymerizable compound includes a photopolymerizable compound having a polyoxyalkylene chain and an ethylenically unsaturated group.