Resist Coating TRIZ Cases
- Nanoimprint Component Carrier Patterning for Fine-Line PCB Structures
Nanoimprint recess patterning replaces LDI to form fine-line component carrier structures with fewer steps and fewer electrical opens.
- Resist Layer Forming Method for Wiring Boards
A resist layer forming method uses a laminate roller and a forming press to adhere the resist layer on a base.
- Wiring Substrate Resin Opening Formation via Photoresist Mold
Photoresist molds shape resin openings in wiring substrates, replacing slow laser radiation to boost manufacturing speed.
- Wiring Board External Terminal Protrusions for Adhesion
Upward protrusions on the external connection terminal bottom layer enhance adhesiveness and heat dissipation, preventing peeling from thermal stress.