Resist Layer Forming Method for Wiring Boards

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Solution Overview

Problem

Conventional resist layer forming methods for wiring boards often result in short circuits between conductive patterns due to gaps formed between the seed layer and the plating resist layer, which are not adequately filled during the lamination process.

Innovation Solution

A resist layer forming method and apparatus that uses a laminator to apply a resist layer at a first pressure and temperature, followed by a forming press with a higher pressure and lower temperature to ensure the resist layer adheres tightly to the base, eliminating gaps and preventing short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resist layer is laminated on a base using only a laminate roller at a certain pressure and temperature, then the lamination process is simple, but gaps form between the resist layer and the base causing short circuits

Engineering Contradiction:

Improveelectrical isolation between conductive patternsVSAvoidnumber of pressing steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The pressing process is divided into two distinct stages: first pressing with a laminate roller at a first pressure and temperature to initially laminate the resist layer, and second pressing with a pressing plate at a second pressure (higher than first) and second temperature (lower than first) to eliminate gaps. This segmentation allows each stage to serve a specific function, ensuring complete contact between the resist layer and base.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes changes in pressure and temperature parameters across two pressing stages. The first pressing uses higher temperature and lower pressure for initial lamination, while the second pressing uses lower temperature and higher pressure to eliminate gaps and ensure complete contact. This parameter variation optimizes the lamination process at each stage.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If high pressure is applied during lamination to eliminate gaps, then adhesion improves, but the resist layer may deform or the base may be damaged

Engineering Contradiction:

Improveadhesion between resist layer and baseVSAvoidintegrity of base and resist layer

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The first pressing with the laminate roller at a first pressure and temperature is performed as a preliminary action to initially laminate the resist layer and prepare it for the second pressing. This preliminary lamination ensures the resist layer is in position and partially bonded before the higher pressure is applied, preventing deformation and damage during the gap-elimination stage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs controlled parameter changes where the second pressure is higher than the first pressure, and the second temperature is lower than the first temperature. This parameter optimization allows high pressure to be applied safely after the resist layer is already in place, eliminating gaps without causing deformation or damage to the base or resist layer.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the occurrence of short circuits between conductive patterns by ensuring complete contact and adhesion of the resist layer, enhancing the electrical isolation between adjacent conductive patterns.

Implementation Method 1

laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature

Methodology Applied

Scientific EffectHeat: Heating

Implementation Method 2

laminating a resist layer on a base at a first pressure using a laminate roller

Methodology Applied

Scientific EffectPressure: Pressure Increase

Implementation Method 3

pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate

Methodology Applied

Scientific EffectPressure: Pressure Increase

Implementation Method 4

metal plate having a second temperature lower than the first temperature

Methodology Applied

Scientific EffectThermal Contraction: Thermal Contraction

Data Source

PatentUS11818847B2Resist layer forming method, method for manufacturing wiring board, and resist layer forming apparatus

Publication Date: 2023.11.14 SHINKO ELECTRIC IND CO LTD

AI summary

A resist layer forming method includes a process of laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature, and a process of pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate having a second temperature lower than the first temperature.