Wiring Board External Terminal Protrusions for Adhesion
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Solution Overview
Problem
Existing wiring boards face issues with external connection terminals peeling or falling off, primarily due to reduced adhesiveness and differences in heat resistance between the insulating layer and the conductive layer.
Innovation Solution
A wiring board design featuring an external connection terminal with a bottom conductive layer and protrusions arranged around a via, which enhances adhesiveness and heat dissipation by increasing the contact area with the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin film by plating is used to form the external connection terminal, then the external connection terminal can be formed to be thin, but the external connection terminal easily peels or falls off from the board
Solution Approach 1:
The invention transitions from a two-dimensional thin film structure to a three-dimensional structure by adding protrusions that extend upward from the bottom conductive layer. These protrusions penetrate through the insulating layer and connect with the wiring layer, creating vertical dimensional extension that significantly increases the bonding interface area and mechanical interlocking, thereby preventing peeling and falling off while maintaining thin overall profile.
Solution Approach 2:
The external connection terminal is segmented into multiple functional components: a bottom conductive layer for electrical connection, multiple protrusions for mechanical anchoring and additional electrical pathways, and an insulating layer for electrical isolation. This segmentation allows each component to perform its specific function optimally, with the protrusions providing both mechanical strength and electrical conductivity.
2Length of moving object
If the external connection terminal is made thin, then the board profile is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The invention applies local quality by concentrating conductive material in specific locations where it is most needed for heat dissipation. The protrusions are strategically positioned to create localized heat sinks and thermal pathways that extend vertically through the insulating layer, providing enhanced heat dissipation at critical points without requiring uniform thickening of the entire terminal structure.
3Reliability
If protrusions are added to the external connection terminal, then adhesiveness and heat dissipation are improved, but manufacturing complexity increases
Solution Approach 1:
The invention merges multiple functions into the protrusion structure: electrical connection, mechanical anchoring, and heat dissipation. By combining these functions into a single integrated feature rather than separate components, the overall device complexity is reduced while achieving multiple performance improvements simultaneously.
Data Source
AI summary
A wiring board includes: an external connection terminal provided at a bottom surface of the wiring board; an insulating layer around the external connection terminal; and a wiring layer that is layered on the insulating layer and is electrically connected with the external connection terminal through a via provided in the insulating layer; wherein the external connection terminal has a bottom conductive layer that constitutes a bottom surface of the external connection terminal with a plurality of protrusions protruding upward on a top surface of the bottom conductive layer.