Negative Photosensitive Resin Composition for Fine Hollow-Sealing Patterns
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Solution Overview
Problem
Existing photosensitive resin compositions struggle with poor resolution when forming fine-sized patterns for hollow sealing structures in electronic parts, which are crucial for miniaturization and high density applications.
Innovation Solution
A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator, specifically utilizing a sulfonium salt, is used to form a photosensitive resin film that undergoes selective exposure and development to create high-resolution patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional photosensitive resin composition is used to form fine-sized patterns, then the hollow sealing structure can be formed, but the resolution is poor
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive resin composition by incorporating specific compounds: a carboxylic acid group-containing resin (A) with controlled molecular weight and functionality, and a sulfonium salt polymerization initiator (B) with specific structural features. These parameter changes in composition and structure enable high-resolution patterning by improving the sensitivity and polymerization characteristics of the resin system.
Solution Approach 2:
The patent creates a composite photosensitive resin composition by combining multiple components with specific functions: the carboxylic acid group-containing resin (A) provides structural framework and reactivity, the sulfonium salt polymerization initiator (B) enables light-triggered polymerization, and optional additives (C) enhance specific properties. This composite material approach achieves both high resolution and manufacturability by synergistic interaction of components.
2Productivity
If miniaturization of the pattern is attempted, then the hollow sealing structure density increases, but the resolution deteriorates
Solution Approach 1:
The patent adjusts critical parameters including the molecular weight of resin (A) within 100-10,000 range, the carboxylic acid functionality, and the sulfonium salt initiator structure to achieve optimal balance between pattern miniaturization capability and resolution maintenance. These parameter optimizations enable formation of finer patterns with higher density while preserving manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of high-resolution patterns and laminated films, suitable for thin, hard cured films required in electronic parts with hollow sealing structures.
Implementation Method 1
a cationic polymerization initiator (I), in which the cationic polymerization initiator (I) includes a sulfonium salt (I0)
Implementation Method 2
a negative photosensitive resin composition containing an epoxy group-containing resin (A) and a cationic polymerization initiator (I)... the photosensitive resin film is selectively exposed to radiation such as light and electron beams, and then a pattern is formed
Data Source
AI summary
A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator which includes a sulfonium salt represented by General Formula (I0). In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom. k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4. A is a group represented by —S—, —O—, —SO—, —SO2—, or —CO— X− represents a monovalent polyatomic anion.