Photosensitive Resin Composition for Thick-Film Hollow Structures

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Solution Overview

Problem

Conventional photosensitive resins face challenges in forming thick films with high elastic modulus, moisture resistance, and fine patterns, particularly for hollow structures in electronic components, due to limitations in material selection and processing difficulties, which affect reliability and durability under high temperature and pressure conditions.

Innovation Solution

A photosensitive resin composition incorporating a photopolymerizable compound with ethylenically unsaturated groups, such as acrylate or methacrylate compounds with amide or urethane bonds, combined with a photopolymerization initiator and inorganic fillers, optimized for high temperature performance and adhesive properties, enabling the formation of thick films with enhanced pattern formability and structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If conventional photosensitive resins are used to form thick films, then film thickness can be increased, but elastic modulus and moisture resistance deteriorate

Engineering Contradiction:

Improvefilm thicknessVSAvoidmoisture resistance and heat resistance

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The patent uses a composite resin system combining epoxy resin and phenolic resin in specific proportions (epoxy resin 30-70 wt%, phenolic resin 70-30 wt%). This composite material achieves both thick film formation capability and high elastic modulus while maintaining excellent moisture and heat resistance, resolving the contradiction between film thickness and reliability.

Inventive Principle:

Principle #40Composite materials

2Device complexity

If photosensitive resin is used for hollow structure formation, then processing complexity is reduced, but elastic modulus at high temperature is insufficient

Engineering Contradiction:

Improveprocessing complexityVSAvoidelastic modulus at high temperature

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The patent develops a photosensitive resin composition containing epoxy resin, phenolic resin, and specific photopolymerization initiators that achieves high elastic modulus at high temperatures while maintaining ease of photolithographic processing. The composite resin system provides the necessary mechanical strength for hollow structures in SAW filters and other electronic components.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent optimizes the chemical composition parameters of the photosensitive resin, including the ratio of epoxy to phenolic resin, molecular weights, and photopolymerization initiator types, to achieve the desired balance between processability and high-temperature mechanical properties.

Inventive Principle:

Principle #35Parameter changes

3Strength

If photosensitive resin composition is optimized for high elastic modulus, then structural integrity improves, but pattern formability deteriorates

Engineering Contradiction:

Improveelastic modulusVSAvoidpattern formability

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent carefully adjusts the composition parameters including epoxy resin content (30-70 wt%), phenolic resin content (70-30 wt%), and photopolymerization initiator concentration to achieve optimal balance between elastic modulus and pattern formability. The specific molecular weight ranges and chemical structures are selected to ensure both mechanical strength and photolithographic performance.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a photosensitive resin composition that achieves high elastic modulus, excellent moisture and heat resistance, and improved hollow structure holding properties, ensuring reliability and durability even under severe conditions, such as high temperature and high humidity environments.

Implementation Method 1

a photopolymerization initiator (B)

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS9005853B2Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component

Publication Date: 2015.04.14 RESONAC CORP

AI summary

Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.