Photosensitive Resin for OLED Anti-Reflective Coatings
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Solution Overview
Problem
The manufacturing of anti-reflective coatings for OLEDs is limited by the need for low-temperature processes, which affects the emission efficiency and increases costs, unlike LCDs that can use high-temperature processes.
Innovation Solution
A photosensitive resin composition with a first binder resin and a second binder resin, both with specific molecular weights and structures, allowing for low-temperature curing and improved developing properties, chemical resistance, and storage stability, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a polarized film is used to prevent reflection of external light, then reflection is reduced, but emission efficiency deteriorates and manufacturing cost increases
Solution Approach 1:
The patent changes the refractive index parameter of the anti-reflective color filter layer by controlling the molecular weight of binder resins (7,000-12,000 g/mol) and using specific chemical compositions (Formula 1 structure with epoxy resin), achieving a refractive index of 1.3-1.5 to minimize light reflection without affecting OLED emission efficiency
Solution Approach 2:
The patent uses a composite material system combining a first binder resin (Formula 1 with specific functional groups) and a second binder resin (epoxy resin) in a weight ratio of 95:5 to 50:50 to create an anti-reflective color filter that simultaneously achieves low reflection and maintains emission efficiency
2Ease of manufacture
If high-temperature process is used for color filter manufacturing, then manufacturing is easier, but OLED structure is damaged
Solution Approach 1:
The patent changes the curing temperature parameter from conventional high-temperature (200°C or higher) to low-temperature (60-100°C) by optimizing the binder resin molecular weight and composition, enabling color filter manufacturing that is compatible with OLED's temperature-sensitive structure
Solution Approach 2:
The patent applies local quality by using a specific molecular weight range (7,000-12,000 g/mol) for binder resins and controlling the weight ratio between first and second binder resins to achieve adequate adhesion and developing properties at low curing temperatures without requiring high-temperature processing
3Reliability
If low-temperature curing is used for photosensitive resin, then OLED structure is protected, but pattern formation quality deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameter of binder resins (7,000-12,000 g/mol) and the chemical structure (Formula 1 with specific functional groups) to achieve proper pattern formation with optimal taper angles (50-80 degrees) at low curing temperatures (60-100°C)
Solution Approach 2:
The patent uses a composite binder resin system combining a first binder resin (Formula 1) and a second binder resin (epoxy resin) with controlled weight ratios to achieve both low-temperature curing capability and high pattern formation quality with good adhesion and developing properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The photosensitive resin composition enables the formation of patterns with optimal taper angles, preventing pattern breakup and enhancing the emission efficiency and manufacturing costs of OLEDs.
Implementation Method 1
a photosensitive resin composition includes a first binder resin and a second binder resin, both with specific molecular weights and structures, allowing for low-temperature curing
Data Source
AI summary
A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.