Positive Photosensitive Resin Composition for OLED Planarization
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Solution Overview
Problem
The challenge in forming insulation and planarization layers for organic light emitting diodes (OLEDs) is to achieve a balance between film residue ratio and sensitivity, as conventional solvents either deteriorate film residue or sensitivity during the slit coating process.
Innovation Solution
A positive photosensitive resin composition is developed, comprising an alkali soluble resin, photosensitive diazoquinone compound, phenol compound, thermal acid generator, and a solvent blend with a low boiling point organic solvent (90-100 wt%) and a high boiling point organic solvent (0-10 wt%), optimizing the solvent ratio to enhance film residue ratio and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional solvent is used for slit coating, then the coating process can be completed, but either film residue ratio or sensitivity deteriorates
Solution Approach 1:
The patent changes the physical and chemical parameters of the solvent system by selecting specific solvents with controlled boiling points (100-200°C) and molecular weights (50-200). This parameter optimization allows the solvent to maintain appropriate interaction with the photosensitive resin components, preventing both excessive film residue and sensitivity loss during the slit coating process.
Solution Approach 2:
The patent employs a composite solvent system consisting of multiple solvent components rather than a single solvent. This composite approach allows the solvent mixture to simultaneously satisfy conflicting requirements: maintaining sufficient solubility for the photosensitive resin (preventing film residue) while providing appropriate volatility characteristics (maintaining sensitivity). The composite solvent system combines the advantages of different solvent components to resolve the contradiction.
2Manufacturing precision
If the solvent interacts strongly with the alkali soluble resin and photosensitive diazoquinone compound, then film residue ratio improves, but film loss during development increases
Solution Approach 1:
The patent optimizes the interaction parameters between solvent and resin components by controlling solvent boiling point (100-200°C) and molecular weight (50-200). This parameter control ensures that the solvent maintains adequate interaction to prevent film residue while not being so strongly bound that it causes excessive film loss during subsequent development processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition improves film residue ratio and sensitivity, ensuring effective pattern formation and uniformity by maintaining solvent interaction with the alkali soluble resin and photosensitive diazoquinone compound, while preventing film loss during development.
Implementation Method 1
the coated layer includes a large amount of a solvent and thus, is generally heated and dried on a hot plate and the like after removing the solvent at room temperature under a reduced pressure
Implementation Method 2
a thermal acid generator
Implementation Method 3
a photosensitive diazoquinone compound
Data Source
AI summary
Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.