Positive Photosensitive Resin Composition for Pattern Forming
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Solution Overview
Problem
Existing positive photosensitive resin compositions fail to meet industry demands in terms of sectional shape and adhesion during development in photolithography processes.
Innovation Solution
A positive photosensitive resin composition comprising novolac resin, an alkali-soluble resin, an ester of o-naphthoquinone diazide sulfonic acid, and a solvent, with specific formulations and processing steps to improve sectional shape and adhesion, suitable for pattern forming methods and applications in thin film transistor array substrates and liquid crystal display devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional positive photosensitive resin compositions are used, then the basic photolithography function is achieved, but the sectional shape and adhesion in development are insufficient
Solution Approach 1:
The patent uses a composite resin system combining novolac resin with specific alkali-soluble resin components (acrylic copolymer and phenolic resin) to achieve both good sectional shape and adhesion. The composite formulation includes epoxy compound, carboxylic acid compound, and specific additives that work together to resolve the contradiction between sectional shape and adhesion properties.
Solution Approach 2:
The patent optimizes specific parameter ranges including the molecular weight of acrylic copolymer (10,000-100,000), the ratio of carboxylic acid groups to epoxy groups (0.8-1.2), and the content of specific resin components (5-50 wt% alkali-soluble resin, 45-95 wt% novolac resin) to simultaneously achieve improved sectional shape and adhesion in development.
2Productivity
If line width is reduced for microminiaturization, then device density is improved, but manufacturing precision of patterns becomes more difficult to maintain
Solution Approach 1:
The patent achieves fine line width (0.5-5 μm) with high manufacturing precision by optimizing parameters including exposure energy density (50-200 mJ/cm²), development time (30-120 seconds), and resin composition ratios. The specific formulation enables precise pattern formation even at reduced line widths, supporting device microminiaturization.
Solution Approach 2:
The patent replaces mechanical/physical constraints with chemical mechanisms to achieve precise pattern formation. The photo-acid generator system chemically modifies the resin to create soluble/insoluble regions, enabling precise patterning without relying solely on physical mask alignment, thus maintaining manufacturing precision at finer line widths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition significantly enhances sectional shape and adhesion in development, leading to improved display properties in thin film transistor array substrates and liquid crystal display devices.
Implementation Method 1
an ester (C) of an o-naphthoquinone diazide sulfonic acid
Implementation Method 2
the alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture contains an epoxy compound (i) and a compound (ii)
Data Source
AI summary
A positive photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.