Photosensitive Resin Remover Composition for Semiconductor Fabrication
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Solution Overview
Problem
The existing methods for removing photosensitive resin patterns in semiconductor device fabrication face challenges such as corrosion of metal patterns and incomplete removal of byproducts, which affect the precision and efficiency of the etching and plating processes.
Innovation Solution
A photosensitive-resin remover composition comprising an amine compound, de-ionized water, a removing accelerator, and a corrosion inhibitor, with specific formulations and ratios, is used to effectively remove photosensitive resin patterns and byproducts without corroding metal patterns, enhancing the removal process's efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive-resin remover is used, then photosensitive resin can be removed, but metal patterns are corroded
Solution Approach 1:
The patent changes the chemical parameters of the remover composition by specifying precise ratios of amine compound (0.1-10 wt%), organic solvent (85-99.9 wt%), and corrosion inhibitor (0.1-5 wt%). This optimized composition achieves effective photosensitive resin removal while minimizing metal pattern corrosion through controlled chemical reactivity.
Solution Approach 2:
The corrosion inhibitor acts as an intermediary substance that protects metal patterns from the harmful effects of the remover composition. It mediates between the aggressive remover chemicals and the metal patterns, preventing direct corrosive interaction while allowing photosensitive resin removal.
2Productivity
If strong remover composition is used to remove hardened photosensitive resin, then removal efficiency increases, but metal corrosion increases
Solution Approach 1:
The patent creates a composite remover composition combining multiple functional components: amine compound for primary removal action, organic solvent for dissolution and penetration, and corrosion inhibitor for metal protection. This composite formulation achieves high removal efficiency on hardened photosensitive resin while the corrosion inhibitor component simultaneously protects metal patterns from damage.
3Manufacturing precision
If conventional remover composition is used, then photosensitive resin removal is achieved, but byproducts remain on metal patterns
Solution Approach 1:
The patent optimizes the composition parameters including amine compound concentration (0.1-10 wt%), organic solvent type and amount (85-99.9 wt%), and corrosion inhibitor content (0.1-5 wt%). This precise parameter control ensures complete removal of photosensitive resin and its byproducts from metal patterns, achieving clean surfaces without residue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for clean removal of hardened or degenerated photosensitive resin and byproducts, reducing reaction time and minimizing metal corrosion, thereby improving the productivity and reliability of semiconductor device fabrication.
Implementation Method 1
a photosensitive-resin remover composition, including an amine compound and de-ionized water
Implementation Method 2
photosensitive resin byproducts degenerated in the etching process may be cleanly removed
Implementation Method 3
The photosensitive-resin remover composition may further include a corrosion inhibitor, the corrosion inhibitor being at least one of an aromatic mercapto compound, an organic compound, and an anhydride including a carboxylic group
Data Source
AI summary
A photosensitive-resin remover composition includes an amine compound and de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition.