Photosensitive Surface Treatment for Photoresist-Free Metal Patterning

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Solution Overview

Problem

Existing pattern formation methods for microdevices require multiple steps, including photoresist application, development, and etching, which are complex and costly. Additionally, these methods often require light-sensitive materials that are unstable and require storage in light-shielded conditions.

Innovation Solution

A photosensitive surface treating agent containing a compound represented by Formula (M1) is applied to a substrate, forming a resin film with reduced photosensitivity due to tert-butoxycarbonyl protection. After deprotection, the film becomes photosensitive, allowing for pattern formation without a photoresist step, and enables electroless plating to create metal patterns with line widths of 5 μm or less.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional photoresist application and etching steps are used for pattern formation, then metal patterns can be formed, but the process becomes complex and costly with multiple steps

Engineering Contradiction:

Improvepattern formation precisionVSAvoidprocess steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the photoresist application and etching steps from the conventional multi-step pattern formation process. By using a photosensitive surface treating agent that directly forms patterns on the substrate surface through light irradiation, the method removes unnecessary intermediate steps while maintaining pattern formation precision, thereby simplifying the overall process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The surface treating agent compound performs multiple functions: it acts as both the surface treatment layer and the photosensitive pattern formation layer. This multi-functional approach eliminates the need for separate photoresist application and etching processes, reducing process complexity while achieving the desired metal pattern formation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If light-sensitive materials are used for pattern formation, then patterns can be created, but the materials become unstable and require light-shielded storage conditions

Engineering Contradiction:

Improvepattern formation capabilityVSAvoidmaterial stability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The invention applies the surface treating agent to the substrate surface beforehand and allows it to form a stable film. The compound is designed to be stable in the dark and only becomes photosensitive after film formation, enabling preliminary preparation without light shielding. This preliminary action separates the stable storage phase from the pattern formation phase, resolving the contradiction between stability and photosensitivity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The compound undergoes a parameter change from a stable, non-photosensitive state during storage and application to a photosensitive state after film formation. The tert-butoxycarbonyl protecting group stabilizes the compound during storage, and upon light irradiation, the group decomposes to generate chemically active substituents, enabling pattern formation. This parameter change allows the material to be stable during storage but active during use.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If conventional electroless plating is performed after photoresist processing, then metal films can be deposited, but the overall process cost and complexity increase

Engineering Contradiction:

Improvemetal film deposition qualityVSAvoidprocess cost and complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention merges the surface treatment function and the photosensitive pattern formation function into a single compound and process step. The surface treating agent forms a patterned layer that directly guides electroless plating, eliminating the need for separate photoresist application, exposure, development, and etching steps. This merging maintains metal film deposition quality while significantly reducing process complexity and cost.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the pattern formation process by eliminating the need for photoresist and etching steps, reduces material instability and storage requirements, and achieves high-definition metal patterning with improved cost-effectiveness and operational efficiency.

Implementation Method 1

a region in which chemically active substituents are generated on a part of the substrate

Methodology Applied

Scientific EffectPhotodecomposition: Photodissociation

Implementation Method 2

An electroless plating treatment is a technique for adhering a metal material onto a substrate to form a metal film

Methodology Applied

Scientific EffectElectroless plating: Electroplating

Data Source

PatentUS20250189894A1Photosensitive surface treating agent, pattern formation substrate, laminate, transistor, pattern forming method and method of producing transistor

Publication Date: 2025.06.12 NIKON CORP

AI summary

A photosensitive surface treating agent containing a compound represented by the following Formula (M1). (In Formula (M1), R1 is a hydrogen atom, a tert-butoxycarbonyl group or an ester-based protecting group, R2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, m is an integer of 1 or more, and X is a halogen atom or an alkoxy group.