Physical Quantity Sensor Bonding Structure for Element Protection

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Solution Overview

Problem

The bonding member in existing composite sensors protrudes into the accommodation portions, potentially contacting sensor elements and causing functional failure or obstructing electrical connections, thereby affecting the reliability and yield of the sensor.

Innovation Solution

A physical quantity sensor design featuring a base body and lid body bonded via a bonding member, where at least one of the bonding surfaces is formed with a pillar structure having a recess and multiple pillar portions to accommodate the bonding member, reducing protrusion and enhancing bonding strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a bonding member is used to bond the substrate and lid body, then the bonding strength is improved, but the bonding member protrudes inside and outside the accommodation portions causing contact with sensor elements and obstruction of terminals

Engineering Contradiction:

Improvebonding strengthVSAvoidprotrusion of bonding member

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a pillar structure with recesses at specific locations on the bonding surfaces. The pillar portions are strategically positioned to provide localized bonding strength enhancement while the recesses accommodate the bonding member material, preventing protrusion. This local structural modification allows the bonding member to be contained within the pillar structure boundaries, eliminating the harmful protrusion effect while maintaining strong bonding.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent implements the nesting principle by having the bonding member material nest within the recesses of the pillar structure. The pillar portions are erected on the bonding surface with recesses that receive and contain the bonding member material, creating a nested configuration where the bonding member is housed within the pillar structure rather than protruding outward. This nesting approach effectively contains the bonding member within defined boundaries.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Strength

If the bonding member protrudes into the accommodation portions, then the bonding area is increased, but the sensor elements may cease to function due to contact with the bonding member

Engineering Contradiction:

Improvebonding areaVSAvoidsensor element functionality

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The pillar structure with recesses provides localized bonding enhancement at specific areas while maintaining clear zones around the accommodation portions. The pillar portions concentrate the bonding function in specific locations, and the recesses contain the bonding member material, preventing it from extending into areas where sensor elements are positioned. This localized approach maintains reliability by preventing contact between the bonding member and sensor elements.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The pillar structure acts as an intermediary between the bonding member and the sensor elements. By introducing this intermediate structure with recesses, the bonding member is mediated to fit within the pillar boundaries rather than directly contacting the sensor elements. This intermediary structure protects the sensor elements from harmful contact while still enabling effective bonding.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the bonding member protrudes outside the accommodation portions, then the bonding strength is enhanced, but the terminals may be covered making electrical coupling difficult

Engineering Contradiction:

Improvebonding strengthVSAvoidelectrical coupling

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The pillar structure provides localized bonding enhancement at specific areas while maintaining clear access to terminal regions. The pillar portions are positioned to concentrate bonding strength where needed, and the recesses contain the bonding member material, preventing it from covering the terminals. This localized approach preserves ease of electrical coupling by keeping terminal areas accessible.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250314676A1Physical Quantity Sensor And Method For Producing Physical Quantity Sensor

Publication Date: 2025.10.09 SEIKO EPSON CORP

AI summary

A physical quantity sensor includes a base body, a physical quantity detection element supported by the base body and configured to detect a physical quantity, and a lid body bonded to the base body via a bonding member and configured to accommodate the physical quantity detection element between the lid body and the base body. When a surface of the base body bonded to the bonding member is defined as a base body bonding surface and a surface of the lid body bonded to the bonding member is defined as a lid body bonding surface, at least one of the base body bonding surface and the lid body bonding surface is formed with a pillar structure having a recess with a bottom and a plurality of pillar portions erected at a bottom surface of the recess and disposed at an interval from each other, and the bonding member enters the recess.