PIC Thermal Plug Layout for EIC Die Heat Removal
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Solution Overview
Problem
Photonic integrated circuits (PICs) positioned between electronic integrated circuit (EIC) dies and integrated heat spreaders hinder efficient heat removal from the EIC dies, limiting their cooling efficiency.
Innovation Solution
Incorporation of thermal plugs within the PIC die that extend through dielectric layers, providing enhanced thermal conductivity and facilitating heat transfer from the EIC die to the integrated heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the PIC die is positioned between the EIC die and the integrated heat spreader, then the PIC die can be integrated with the EIC die in a multi-chip package, but heat removal from the EIC die is limited
Solution Approach 1:
The PIC die is segmented into multiple functional layers, with thermal plugs strategically positioned in specific dielectric layers to create dedicated heat conduction pathways. This segmentation allows the thermal management function to be separated from the photonic functionality, enabling efficient heat removal while maintaining integration.
Solution Approach 2:
Thermal plugs serve as intermediary structures between the EIC die and the integrated heat spreader. These plugs act as thermal mediators that facilitate heat transfer through the PIC die, bridging the thermal gap created by the multi-chip package configuration.
2Temperature
If thermal plugs are added to the PIC die, then heat transfer efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The thermal plugs are merged with the existing dielectric layers and contact pad structures of the PIC die. By combining the thermal management function with existing structural elements, the design achieves enhanced heat transfer without proportionally increasing overall device complexity.
Solution Approach 2:
The dielectric layers in the PIC die serve dual purposes: providing electrical insulation for photonic operations and serving as a matrix for thermal plug integration for heat management. This multi-functionality reduces the need for separate dedicated thermal management structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal plugs effectively reduce the maximum temperature of the EIC die, improving heat removal efficiency and maintaining the EIC die within specified temperature limits.
Implementation Method 1
The thermal plugs have a higher coefficient of thermal conductivity and transport heat through the dielectric layer more efficiently than the dielectric layer itself
Data Source
AI summary
Technologies for thermal plugs in photonic integrated circuit (PIC) dies are disclosed. In an illustrative embodiment, several thermal plugs extend from contact pads in a PIC die, through a dielectric layer, to a waveguide layer. The thermal plugs can carry heat at a higher rate than the surrounding dielectric layer, increasing the heat transfer through the PIC die. The PIC die may be mounted on an electronic integrated circuit (EIC) die in an integrated circuit component. The PIC die can transfer heat from the EIC die, through the PIC die, and to another component such as an integrated heat spreader, lowering the temperature of the EIC die. The thermal plugs can increase the heat transfer through the PIC die.