Pick-Up Head Gas Flow Control for Chip Warpage Suppression
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Solution Overview
Problem
Conventional semiconductor manufacturing apparatuses face challenges in achieving high precision and reliability during chip bonding due to warpage and residual stress, which can lead to voids and bonding failures, especially when using flip chip or through-silicon via connections that require sub-micrometer precision and high temperature/high pressure.
Innovation Solution
A semiconductor manufacturing apparatus with a pick-up head featuring a holding surface with ejection and suction holes, a warpage measurement device, and a controller that adjusts gas flow rates to manage warpage, allowing for non-contact chip handling and precise positioning to minimize stress and ensure accurate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If non-contact chip handling using pressurization and suction is used, then foreign matter entry is suppressed, but chip warpage and stress occur
Solution Approach 1:
The holding surface is divided into multiple regions with different suction pressures applied to each region. The controller adjusts the suction pressure locally based on measured warpage, applying higher pressure to areas with greater deformation and lower pressure to areas that are already flat, thereby suppressing warpage while maintaining non-contact handling
Solution Approach 2:
A warpage measurement device measures the chip's warpage in real-time during handling, and the controller uses this feedback information to dynamically adjust the suction pressure distribution across different regions of the holding surface, creating a closed-loop control system that continuously suppresses warpage
2Strength
If high temperature and high pressure are applied for direct metal bonding, then bonding strength is improved, but precision is reduced due to mechanical and thermal structure changes
Solution Approach 1:
The chip's warpage is measured and corrected in advance during the handling process, before the bonding operation begins. This preliminary correction ensures that the chip is flat when bonding occurs, allowing high-precision bonding to be achieved even under high temperature and pressure conditions
Solution Approach 2:
The system replaces mechanical contact-based handling with non-contact pneumatic handling using pressurization and suction holes, which reduces mechanical stress and warpage on the chip, thereby maintaining bonding precision during subsequent high-temperature and high-pressure bonding processes
3Ease of operation
If uniform suction pressure is applied across the entire holding surface, then chip holding is simplified, but warpage cannot be effectively suppressed
Solution Approach 1:
The holding surface is segmented into multiple independent regions, each controlled by separate pressurization and suction holes. This segmentation allows different suction pressures to be applied to different regions, enabling effective warpage suppression while maintaining relatively simple operation through automated control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves highly reliable mounting by controlling gas flow rates to suppress warpage and maintain chip flatness, reducing the occurrence of voids and residual stress, thereby enhancing the precision and reliability of semiconductor device bonding.
Implementation Method 1
a plurality of ejection holes through which gas is ejected, and a plurality of suction holes through which the gas is suctioned
Data Source
AI summary
In order to provide a semiconductor manufacturing apparatus capable of realizing highly reliable mounting, a semiconductor manufacturing apparatus includes a pick-up head having a plurality of ejection holes for ejecting gas and a plurality of suction holes for suctioning the gas provided in a holding surface that holds a chip. A warpage measurement portion is configured to measure warpage of the chip held by the pick-up head, and a controller is configured to control at least one of a gas supply flow rate from the plurality of ejection holes and a suction flow rate from the plurality of suction holes in response to the measured warpage of the chip.