Piezoelectric Air Agitator for High-Power Electronics Cooling
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Solution Overview
Problem
High-power-dissipating electronics face challenges in thermal management due to heat accumulation, which can lead to premature failure and require effective cooling techniques to maintain a designed working temperature range.
Innovation Solution
An air agitator assembly comprising a perforated flexible structure with a thermally absorbing and reflective surface, coupled with a piezoelectric structure that oscillates to enhance air circulation and convective heat transfer, is used to absorb heat from heat-emitting objects and dissipate it efficiently through both convection and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If natural convection is used for cooling high-power electronics, then the cooling system is simple and lightweight, but the heat transfer rate is insufficient to maintain working temperature
Solution Approach 1:
The patent applies piezoelectric structures that vibrate at resonance frequencies to agitate air molecules and enhance convective heat transfer. The vibration frequency is specifically tuned to match the natural resonance frequency of air molecules, creating maximum agitation and heat transfer efficiency without requiring high power input.
Solution Approach 2:
The patent changes the physical state and motion parameters of air by introducing controlled vibrations at specific frequencies. This transforms natural convection into enhanced convection by modifying the kinetic energy and movement patterns of air molecules, thereby increasing heat transfer rates significantly.
2Temperature
If conventional cooling fans are used to increase air circulation, then heat dissipation improves, but the device complexity and weight increase
Solution Approach 1:
The patent replaces conventional mechanical cooling fans with piezoelectric structures that generate vibrations through electrical-to-mechanical energy conversion. This substitution eliminates the need for bulky fan assemblies, motors, and control mechanisms while achieving superior cooling performance through resonance-based air agitation.
Solution Approach 2:
The patent employs thin, flexible piezoelectric structures that can be directly integrated onto electronic components. These thin-film piezoelectric elements vibrate to agitate air molecules without requiring the complex mechanical assemblies of conventional fans, thereby reducing overall system complexity and weight.
3Temperature
If high power is used to drive cooling systems, then heat dissipation is effective, but energy consumption increases
Solution Approach 1:
The patent utilizes resonance vibrations at natural frequencies of air molecules, which require minimal energy input to sustain. By operating at resonance, the piezoelectric structures achieve maximum cooling effect with minimum power consumption, avoiding the energy-intensive operation of conventional forced convection systems.
Solution Approach 2:
The patent employs periodic vibrations at specific frequencies that match the natural resonance frequency of air molecules. This periodic action creates sustained air agitation and enhanced heat transfer without requiring continuous high-power input, thereby reducing overall energy consumption while maintaining effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air agitator assembly achieves significantly improved heat transfer rates, up to five times greater than natural convection, providing effective cooling for electronic devices with high power dissipation, while being lightweight, easy to manufacture, and offering additional structural integrity.
Implementation Method 1
at least one piezoelectric structure located on the perforated flexible structure and operably coupled to a power source wherein heat emitted from the heat-emitting object is absorbed by the first side and actuation of the at least one piezoelectric structure results in movement of the perforated flexible structure
Implementation Method 2
a perforated flexible structure having a thermally absorbing first side confronting and spaced from a portion of the heat-emitting object to define an air space there between
Implementation Method 3
actuation of the at least one piezoelectric structure results in movement of the perforated flexible structure to move the volume of the air located between the hot source and the agitator assembly with the local ambient air
Data Source
AI summary
An air agitator assembly for use with a heat-emitting object having a contour, the air agitator assembly including a perforated flexible structure having a thermally absorbing first side confronting and spaced from a portion of the heat-emitting object to define an air space there between and a second side opposite the first side and where at least a portion of the first side of the perforated flexible structure has a contour that matches a contour of a corresponding portion of the heat-emitting object.