Surface Mount Piezoelectric Oscillator Noise Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturized piezoelectric oscillators are adversely affected by radiation noise due to phase and current differences between signals from the integrated circuit element and the piezoelectric oscillation element, leading to operational problems and potential interference with the oscillation frequency.
Innovation Solution
The design incorporates a laminated substrate base with specific internal terminal pads and wiring patterns that form conductive paths to block radiation noise, ensuring the piezoelectric oscillation element is isolated from noise-generating signals, while also allowing for flip-chip bonding with pads of varying sizes to accommodate different integrated circuit elements, enhancing reliability and versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the piezoelectric oscillator is miniaturized, then the size is reduced, but radiation noise adversely affects operation
Solution Approach 1:
A ground potential wiring pattern is introduced as an intermediary between the rectangular wave signal path and the sine wave signal path. This ground wiring acts as a shield that intercepts and redirects radiation noise to ground, preventing it from reaching the piezoelectric oscillation element and causing operational interference.
Solution Approach 2:
The harmful radiation noise is extracted from the signal path by providing a dedicated ground connection for the rectangular wave signal. The noise is separated from the sensitive sine wave signals by routing the noisy signal through a ground-referenced path, effectively removing the harmful components from the oscillation circuit.
2Ease of operation
If different sized pads are used for flip-chip bonding, then mountability is improved, but device complexity increases
Solution Approach 1:
Different regions of the base are assigned different pad sizes and configurations according to their specific functional requirements. The signal input/output pads are sized differently from the ground pads, with each pad's dimensions optimized for its particular role in the circuit, allowing versatile mounting options without requiring a completely complex redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively blocks radiation noise, maintaining high operational reliability and allowing for miniaturization without compromising noise blocking, improving mountability and bonding reliability in piezoelectric oscillators.
Implementation Method 1
piezoelectric oscillation elements, for example, crystal oscillation plates, are used
Implementation Method 2
pads of an integrated circuit element are flip-chip bonded, by means of metallic bumps made of such a material as gold, to internal terminal pads in a housing portion of a ceramic base by supersonic thermocompression bonding
Data Source
AI summary
A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween.