Piezoelectric MEMS Substrate Layout for Device Miniaturization
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Solution Overview
Problem
Existing piezoelectric devices face challenges in miniaturization due to the need for separate positions for through wiring and photosensitive bonding agents, which hinders compact design integration.
Innovation Solution
A piezoelectric device configuration using three substrates where the intermediate substrate has through holes with conductive electrodes that electrically connect the first and second electrodes, eliminating the need for separate bump electrodes and simplifying the structure for miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If through wiring and photosensitive bonding agent are provided at separate positions, then electrical connection and substrate bonding can be achieved, but device size cannot be reduced
Solution Approach 1:
The patent merges the through wiring and photosensitive bonding agent into a single integrated structure. The through wiring is formed with a photosensitive bonding agent layer on its outer peripheral surface, allowing both electrical connection and substrate bonding functions to be performed at the same location. This eliminates the need for separate positioning of these components, thereby enabling device miniaturization while maintaining structural integrity.
2Volume of moving object
If through wiring and bump electrode are at different positions, then electrical coupling can be established, but miniaturization is hindered
Solution Approach 1:
The patent integrates the bump electrode formation process with the through wiring structure. The bump electrode is formed on the outer peripheral surface of the through wiring, combining multiple electrical connection functions into a single integrated component. This reduces the number of discrete elements and simplifies the manufacturing process while enabling device miniaturization.
3Adaptability or versatility
If multiple separate components are used for electrical connection and bonding, then functional requirements are met, but device complexity increases
Solution Approach 1:
The through wiring structure is designed to perform multiple functions simultaneously: it provides electrical connection through its conductive core, enables substrate bonding through the photosensitive bonding agent layer on its outer peripheral surface, and supports bump electrode formation for additional electrical coupling. This multi-functional integration reduces the total number of components while maintaining all necessary functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for reduced device size and enhanced bonding strength between substrates, enabling efficient electrical coupling without additional bonding layers and maintaining structural integrity.
Implementation Method 1
The actuator unit is a piezoelectric device that is provided with a piezoelectric element as an MEMS element
Implementation Method 2
The sealing plate is provided with a photosensitive bonding agent on an outer peripheral part of the surface facing the vibration plate, and is adhesively bonded to the vibration plate by the photosensitive bonding agent
Data Source
AI summary
Provided is a piezoelectric device and an MEMS device whose size can be reduced. The piezoelectric device includes: a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed; a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed; and a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, in which the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode.