Piezoelectric Package Layout for Accurate Temperature Sensing
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Solution Overview
Problem
Existing piezoelectric devices face challenges in accurately measuring temperature due to the proximity of temperature sensor elements to the bottom surface of the package, which can lead to excessive external heat influence and deviations in measured temperature.
Innovation Solution
The configuration includes a piezoelectric device with a piezoelectric element, a mount base, and a temperature sensor element, where the temperature sensor element is positioned closer to the upper end of the recess than the piezoelectric element, reducing the impact of external heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the temperature sensor element is mounted on or near the bottom surface of the package, then it is easy to mount and integrate, but external heat easily affects the sensor leading to inaccurate temperature measurements
Solution Approach 1:
The temperature sensor element is positioned in the vertical dimension (upper end of the recess) rather than being mounted on the bottom surface, changing the spatial dimension of sensor placement to achieve thermal isolation from external heat sources while maintaining integration within the package structure
2Device complexity
If the temperature sensor element is positioned close to the bottom surface of the recess, then the package structure is simplified, but external heat influence increases causing temperature measurement deviations
Solution Approach 1:
The sensor is repositioned from the bottom surface level to the upper end of the recess in the vertical dimension, creating spatial separation from external heat sources without adding complex structural elements, thus maintaining simple package structure while reducing thermal interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the probability of external heat affecting the temperature sensor, ensuring that the measured temperature more accurately reflects the temperature of the piezoelectric element, thereby improving the device's temperature measurement accuracy.
Implementation Method 1
a piezoelectric element including a piezoelectric material (for example, a quartz crystal blank), two excitation electrodes stacked on the piezoelectric material
Data Source
AI summary
A piezoelectric device includes a piezoelectric element, a mount base, and a temperature sensor element. The mount base includes a recess configured to be hermetically sealed. The recess includes a bottom surface on which the piezoelectric element is mounted. The temperature sensor element includes a portion located closer to an upper end of the recess than the piezoelectric element.