Piezoelectric Device Pad Relocation for Thinner Design
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Solution Overview
Problem
Existing piezoelectric devices face challenges in achieving a thin and compact design due to the need for gaps between the piezoelectric resonator element and wires, which limits their thickness, and the inflexibility in pad placement restricts the versatility and size of the IC chip.
Innovation Solution
The integration of an insulating layer, relocation pads, and a connector system allows for flexible pad placement and wire routing, eliminating the need for wires between the piezoelectric resonator and the IC chip, enabling a thinner and more versatile device design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire is disposed between the principal plane of the piezoelectric resonator element and the active face of the IC chip, then electrical coupling is achieved, but a gap must be provided to avoid contact which increases the thickness of the device
Solution Approach 1:
The invention transitions the wire arrangement from a vertical configuration (between resonator and IC chip) to a planar configuration (on the IC chip surface). The wire is routed along the surface of the IC chip to connect the pad to the bonding pad, eliminating the need for vertical clearance and enabling device thinning.
Solution Approach 2:
The invention introduces a bonding pad as an intermediary element on the IC chip surface. The wire connects the pad to this bonding pad, which then connects to the resonator, providing a reliable electrical coupling path without requiring the wire to pass through the vertical space between components.
2Reliability
If the longer side of the IC chip and the longer side of the piezoelectric resonator element cross each other when viewed in plan, then a pad can be disposed in a non-overlapping area, but the planar size of the device becomes large and the IC chip arrangement is restricted
Solution Approach 1:
The invention makes the wire routing dynamic and flexible by allowing it to be arranged in various paths on the IC chip surface. The wire can be routed along edges, through insulating regions, or in curved paths to reach optimal connection points, enabling compact layouts without fixed geometric constraints.
Solution Approach 2:
The invention applies different structural characteristics to different regions of the IC chip. Insulating regions are strategically placed to allow wire routing, while other regions maintain standard chip structure. This localized differentiation enables compact wiring without affecting the overall chip design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the thickness and planar size of the piezoelectric device, enhances its characteristics, and allows for adjustable oscillation frequency without additional circuits, facilitating the use in various electronic apparatuses.
Implementation Method 1
a piezoelectric resonator element (30) made from a piezoelectric plate (30a) on which an electrode pattern is formed
Implementation Method 2
a wire (28) couples the pad (16) with a pad electrode (40)
Data Source
AI summary
A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.