Piezoelectric Sensor Insulation Structure for Vibration-Resistant Wiring
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Solution Overview
Problem
Existing piezoelectric sensors face issues with poor adhesion between the wiring layer and organic insulation layer, leading to peeling and potential burning due to high-frequency vibrations, especially when using thick film PZT piezoelectric ceramics.
Innovation Solution
Incorporating an inorganic insulation layer between the wiring layer and organic insulation layer, with specific via hole configurations and material choices to enhance adhesion and prevent peeling, ensuring strong connections and preventing high heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic insulation layer is used between the wiring layer and piezoelectric element, then flexibility and ease of manufacture are improved, but adhesion strength deteriorates causing peeling under high-frequency vibrations
Solution Approach 1:
The patent uses a composite insulation structure combining organic insulation layer and inorganic insulation layer. The organic layer provides flexibility and ease of manufacture, while the inorganic layer provides strong adhesion to prevent peeling under high-frequency vibrations. This composite approach resolves the contradiction by combining materials with complementary properties.
Solution Approach 2:
The inorganic insulation layer acts as an intermediary between the wiring layer and organic insulation layer, providing a stable adhesion interface that prevents direct contact between the wiring layer and organic layer, thereby preventing peeling while maintaining manufacturing ease.
2Device complexity
If the wiring layer is directly connected to the piezoelectric element without adequate insulation, then device complexity is reduced, but reliability deteriorates due to short circuit risk between electrodes
Solution Approach 1:
The patent employs a composite insulation system with both organic and inorganic layers to ensure reliable electrical isolation between the wiring layer and piezoelectric element electrodes, preventing short circuits while maintaining a relatively simple device structure.
Solution Approach 2:
The dual-layer insulation structure serves as an intermediary barrier between conductive elements, providing reliable electrical isolation without requiring complex insulation schemes, thus maintaining device simplicity while ensuring reliability.
3Power
If thick film PZT piezoelectric ceramics are used, then piezoelectric performance is improved, but adhesion between wiring layer and insulation layer deteriorates leading to burning under vibration
Solution Approach 1:
The patent uses thick film PZT piezoelectric ceramics for high piezoelectric performance while combining organic and inorganic insulation layers to prevent adhesion failures and burning under vibration, thus maintaining reliability despite the use of high-performance but vulnerable piezoelectric material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves adhesion and reduces the risk of wiring layer failure, maintaining sensor integrity and functionality under high-frequency vibrations.
Implementation Method 1
a piezoelectric layer between the first electrode and the organic insulation layer
Data Source
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Figure 5~6A
AI summary
Embodiments of the present disclosure provide a piezoelectric sensor and a haptic feedback apparatus. The piezoelectric sensor includes a base substrate; at least one piezoelectric device located on the base substrate; an organic insulation layer located on one side, facing away from the base substrate, of the piezoelectric device, where the organic insulation layer is provided with a first via hole, and an orthographic projection, on the base substrate, of the first via hole overlaps an orthographic projection, on the base substrate, of the piezoelectric device; an inorganic insulation layer located on one side, facing away from the base substrate, of the organic insulation layer, where the inorganic insulation layer does not overlap at least a portion of the first via hole; and a wiring layer located on one side, facing away from the base substrate, of the inorganic insulation layer, where the wiring layer includes a wire, one end of the wire being electrically connected to the piezoelectric device by means of at least the portion of the first via hole.