Piezoelectric Deformation Sensor Layout for Thin Wiring Connection

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Solution Overview

Problem

Existing deformation detection sensors using piezoelectric films require additional mounting components, increasing thickness and compromising the thin film's characteristics, and necessitate securement of terminal components, which complicates the design.

Innovation Solution

A deformation detection sensor design that integrates a detection electrode, first and second ground electrodes, a piezoelectric film, and a substrate with a joint member connecting the wiring and detection electrode, eliminating the need for terminal components by positioning the joint on the opposite side of the piezoelectric film.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a mounting component such as a terminal component is used to connect the sensor and wiring, then the sensor can be connected to the wiring, but the thickness of the sensor increases and characteristics of a thin piezoelectric film cannot be utilized

Engineering Contradiction:
Improvethickness of sensorVSAvoidconnection method
Core Design Contradiction:
Length of moving objectVSEase of manufacture

Solution Approach 1:

The patent removes the mounting component (terminal component) from the sensor structure entirely. The wiring is directly connected to the detection electrode through a joint member formed on the substrate, extracting the unnecessary mounting component that was increasing sensor thickness while maintaining the electrical connection function.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the connection function into the substrate itself by forming the joint member directly on the substrate surface. This combines the substrate's structural role with the electrical connection role, eliminating the need for separate mounting components and reducing overall sensor thickness.

Inventive Principle:
Principle #5Merging (Combining)

2Device complexity

If a mounting component is used to connect the sensor and wiring, then the connection is established, but it is necessary to secure a mounting part for mounting the terminal component on the sensor

Engineering Contradiction:
Improvestructure complexityVSAvoidarea of sensor
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The patent extracts and removes the mounting component and its associated mounting part from the sensor structure. The joint member is formed directly on the substrate, eliminating the need for separate terminal components and their mounting structures, thereby reducing device complexity and sensor area.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the electrical connection function and mechanical support function into the substrate and joint member assembly. This merging eliminates the need for separate mounting parts, reducing both structural complexity and the area occupied by mounting structures.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If the joint member is positioned on the first face side where the piezoelectric film is disposed, then the wiring can be connected, but the area occupied by the piezoelectric film decreases

Engineering Contradiction:
Improvearea occupied by piezoelectric filmVSAvoidwiring connection
Core Design Contradiction:
Area of stationary objectVSEase of operation

Solution Approach 1:

The patent inverts the conventional approach by positioning the joint member on the second face side of the substrate (opposite to where the piezoelectric film is disposed) instead of on the first face side. This inversion allows the piezoelectric film to occupy maximum area on the first face side while wiring connection is performed on the opposite side through the joint member.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows the piezoelectric film to occupy a larger area, reducing the overall sensor size while maintaining sensitivity and mechanical strength, and improves detection sensitivity by transmitting strain through extended connections.

Implementation Method 1

a piezoelectric film sandwiched between the detection electrode and the first ground electrode

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12484448B2Deformation detection sensor
Publication Date: 2025.11.25 MURATA MFG CO LTD
  • US12484448B2 patent drawing
  • US12484448B2 patent drawing
  • US12484448B2 patent drawing

AI summary

A deformation detection sensor is provided that includes a detection electrode, a first ground electrode, a piezoelectric film sandwiched between the detection electrode and the first ground electrode, a substrate on which the detection electrode and a second ground electrode are formed, a wiring connected to the detection electrode, and a joint member that joins the wiring and the detection electrode.