Wafer-Level Piezoelectric Component With Shared Through Hole
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer-level package-type electronic components face challenges in efficiently sealing and electrically connecting piezoelectric substrates to external circuits, particularly in maintaining acoustic wave propagation and vibration functionality while ensuring reliable bonding and size reduction.
Innovation Solution
The electronic component design includes a chip with a functional part and terminal, an intermediate member with a through hole surrounding the functional part, and a lid with overlapping through holes, using electrically conductive bonding members that are molten and bonded to the terminal, eliminating the need for via conductors and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate through holes are provided for bonding members and via conductors, then reliable electrical connection is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines the through hole for bonding member placement with the via conductor structure into a single integrated through hole. The via conductor is formed within the same through hole that accommodates the bonding member, eliminating the need for separate through holes. This merging reduces structural complexity while maintaining reliable electrical connection between the piezoelectric substrate and external circuits.
2Reliability
If dedicated through holes are provided for bonding members, then electrical connection is ensured, but the chip size increases
Solution Approach 1:
The patent integrates the bonding member through hole with the via conductor structure, allowing both functions to coexist within a single through hole. This eliminates the need for additional dedicated through holes for bonding members, thereby reducing the overall chip area while ensuring reliable bonding connection.
3Adaptability or versatility
If multiple separate through holes are provided, then functional requirements are met, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges the bonding member through hole and via conductor into a single through hole structure. This reduces the number of through holes from multiple separate holes to a single integrated structure, thereby reducing the cumulative alignment precision requirements and simplifying the manufacturing process.
4Reliability
If via conductors are provided in separate through holes, then electrical connection is achieved, but the number of manufacturing steps increases
Solution Approach 1:
The patent combines the via conductor formation process with the bonding member through hole creation into a single manufacturing step. The via conductor is formed within the same through hole that will accommodate the bonding member, eliminating separate manufacturing steps for through hole drilling, via conductor formation, and bonding member placement, thereby improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the sealing and electrical connection of the piezoelectric substrate, maintains acoustic wave propagation, and allows for size reduction by eliminating dedicated through holes for bonding, improving the reliability and efficiency of the electronic component.
Implementation Method 1
the bonding member, in a molten state, is supplied into the second through hole and bonds to the terminal
Implementation Method 2
the functional part that occupies a portion of the first surface and is configured to vibrate
Implementation Method 3
acoustic waves (for example, surface acoustic waves (SAWs)) that propagate along the main surface of the piezoelectric substrate are excited
Implementation Method 4
When a voltage (from another perspective, an electrical signal) is applied to the main surface of the piezoelectric substrate using the excitation electrode, acoustic waves (for example, surface acoustic waves (SAWs)) that propagate along the main surface of the piezoelectric substrate are excited. Conversely, acoustic waves are also converted into an electrical signal.
Data Source
AI summary
In an electronic component, a chip includes a vibrating functional part and a terminal on a first surface thereof. An intermediate member is stacked on the first surface. The intermediate member includes a first through hole above the functional part and surrounds the functional part in plan view. A lid is stacked on a surface of the intermediate member on the opposite side from the chip and closes the first through hole. A bonding member includes an upper end located on the opposite side of the lid from the intermediate member. The intermediate member surrounds the terminal as well as the functional part. The lid includes a second through hole overlapping the terminal out of the functional part and the terminal. The bonding member includes a center portion located inside the second through hole and a lower end located inside the first through hole and bonded to the terminal.