Piezoelectric Vibrating Plate Wiring With Slits to Prevent Cracking

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Solution Overview

Problem

In existing piezoelectric devices, bypass wires placed in non-vibrating regions adjacent to vibrating regions are prone to cracking due to stress transfer during deformation, which can lead to device failure.

Innovation Solution

The introduction of slits penetrating the bypass wires in the thickness direction, allowing for flexibility and reducing stress concentration, along with the use of auxiliary wires with higher flexibility than the bypass wires to couple divided sections, effectively mitigates cracking and suppresses vibration crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bypass wires are placed in non-vibrating regions adjacent to vibrating regions, then electrical coupling to piezoelectric elements is achieved, but stress transfer during deformation causes cracking in the bypass wires

Engineering Contradiction:
Improvewire integrityVSAvoidstress concentration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The bypass wires are divided into multiple segments by introducing slits that penetrate through the wire thickness. These slits create discrete sections that can move independently, preventing stress concentration and cracking while maintaining electrical connectivity through the segmented structure

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bypass wires are designed with a flexible structure by introducing slits that allow the wire to bend and deform elastically during vibration cycles. This flexibility enables the wire to accommodate stress without cracking, while the thin film nature of the wire maintains low electrical resistance

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If slits are introduced in bypass wires to prevent cracking, then wire flexibility and stress resistance improve, but electrical resistance may increase

Engineering Contradiction:
Improvewire durabilityVSAvoidelectrical resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The slits are strategically positioned in specific regions of the bypass wire where stress concentration occurs during vibration, rather than uniformly throughout the wire. This localized approach provides stress relief where needed while maintaining continuous, low-resistance electrical pathways in other critical regions

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The bypass wire structure combines conductive material with slit configurations to create a composite structure that maintains electrical conductivity while providing mechanical flexibility and stress resistance

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents cracking in bypass wires and reduces vibration transmission to adjacent regions, enhancing the durability and performance of piezoelectric devices by allowing for flexible wire configurations that maintain low electrical resistance.

Implementation Method 1

piezoelectric elements provided in the vibrating regions... the piezoelectric element deforms according to voltage application

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12156475B2Piezoelectric device having plurality of vibrating regions and electronic apparatus
Publication Date: 2024.11.26 SEIKO EPSON CORP
  • US12156475B2 patent drawing
  • US12156475B2 patent drawing
  • US12156475B2 patent drawing

AI summary

A piezoelectric device includes a substrate having opening portions, a vibrating plate provided to overlap with the substrate and having a plurality of vibrating regions overlapping with the opening portions in a plan view as seen from a thickness direction of the substrate, piezoelectric elements provided in the vibrating regions, and bypass wires provided outside of the vibrating regions of the vibrating plate and electrically coupled to the plurality of piezoelectric elements, wherein slits penetrating the bypass wires in the thickness direction are provided in the bypass wires.