Pivoting Heat Dissipating Structure for Detachable Modules

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Solution Overview

Problem

Modular electronic devices with fanless cooling designs face challenges in rapid heat dissipation due to long heat dissipation paths and high heat resistance, and the fixed heat dissipating structures often interfere with the detachment of modules, making the process inconvenient.

Innovation Solution

A heat dissipating structure that includes a driving component, a driven component, and a heat dissipating component, where the driving component on the detachable module slides relative to the case module, pivoting the driven component to abut against both the module and the case for efficient heat transfer, and reversibly separates during detachment to prevent interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fixed heat dissipating structure is used to conduct heat from the detachable module to the case, then the heat dissipation path is stable and reliable, but the heat dissipation path becomes long and heat resistance increases, causing heat to dissipate slowly

Engineering Contradiction:

Improveheat dissipation stabilityVSAvoidheat dissipation speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The heat dissipating structure transitions from a fixed configuration to a dynamic one that can adjust its position and contact pressure. The elastic component allows the heat dissipating component to move closer to the detachable module when installed, creating a shorter heat dissipation path while maintaining reliable thermal contact through elastic force.

Inventive Principle:

Principle #15Dynamics

2Reliability

If a fixed heat dissipating structure is installed on the case, then heat dissipation is effective, but the structure interferes with the detachment of the detachable module, requiring the case to be opened first

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidmodule detachment convenience

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The heat dissipating structure is designed to be dynamically adjustable rather than fixed. When the detachable module is removed, the elastic component allows the heat dissipating component to retract or adjust its position, eliminating interference with module detachment while maintaining effective heat dissipation when the module is installed.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The heat dissipating structure is divided into separable components: a heat dissipating component that contacts the detachable module and a mounting structure on the case. This segmentation allows the heat dissipating component to be independently positioned and adjusted, enabling it to maintain thermal contact during operation while not interfering with module removal.

Inventive Principle:

Principle #1Segmentation

3Productivity

If the heat dissipating structure is made adjustable to improve heat dissipation speed, then the heat dissipation path shortens and heat resistance decreases, but the structure complexity increases

Engineering Contradiction:

Improveheat dissipation speedVSAvoidstructure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The elastic component automatically adjusts the position and contact pressure of the heat dissipating component based on the installation state of the detachable module. When the module is installed, the elastic force pushes the heat dissipating component into optimal thermal contact; when removed, the structure naturally reconfigures without requiring manual intervention or complex control mechanisms.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a simple, efficient heat dissipation path with low resistance and enhances operability by allowing seamless detachment of modules without needing to remove the heat dissipating structure, improving both heat dissipation and user convenience.

Implementation Method 1

the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11202391B2Heat dissipating structure capable of conducting heat from a detachable module to a case module, and electronic device therewith

Publication Date: 2021.12.14 MOXA INC

AI summary

A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.