Pixel Array Substrate Through-Hole Layout for Bezel-Less Isolation
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Solution Overview
Problem
The light-emitting diode display panel faces issues with insufficient layout area due to the need for both pixel driving circuits and light-emitting diode elements on the same surface, leading to potential short circuits when panels are spliced together for seamless displays.
Innovation Solution
A pixel array substrate design featuring a substrate with through holes for conductors, a pixel driving circuit on one surface, and pads on the other, including dummy conductors to prevent short circuits, along with a dielectric layer and specific conductor configurations to isolate components electrically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conductors are disposed on the sidewall of the substrate to enable narrow bezel or bezel-less display, then the display area is increased, but the risk of short circuit between adjacent panels increases
Solution Approach 1:
An insulating layer is introduced as an intermediary between conductors of adjacent panels. This insulating layer fills the gap between conductors from different panels, preventing direct contact and short circuits while allowing the conductors to extend to the sidewall for narrow bezel implementation.
Solution Approach 2:
The insulating layer is applied in advance to the substrate sidewall before conductor formation. This preliminary protective measure ensures that when conductors are formed extending to the sidewall, they are pre-protected from contacting conductors of adjacent panels, preventing short circuits before they can occur.
2Device complexity
If pixel driving circuit and light-emitting diode elements are disposed on the same surface, then the integration is simplified, but the layout area becomes insufficient
Solution Approach 1:
The substrate is designed with a sidewall dimension that extends vertically from the main surface. Conductors are disposed on this sidewall, utilizing the vertical dimension to accommodate additional conductive pathways without occupying more horizontal layout area, thus maintaining high integration while preserving sufficient layout space.
Solution Approach 2:
The conductor structure is nested by extending it from the main substrate surface onto the sidewall. This nested configuration allows conductors to occupy the vertical sidewall space rather than competing for horizontal plane area, enabling both high integration and sufficient layout area.
Data Source
AI summary
A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.