Pixel Array Package Structure for Small-Pitch Seamless LED Displays
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Solution Overview
Problem
Current display technologies face challenges in achieving small pitch operations with RGB LEDs due to process limitations, leading to reduced light output and splicing gaps in large-sized displays, which affect display quality and continuity.
Innovation Solution
A pixel array package structure comprising a substrate, pixel array with LED chips, reflective and light-absorbing layers, and a light-transmitting layer, designed to enhance luminous efficiency and minimize splicing gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-absorbing particles are added into the encapsulant to increase contrast, then the contrast is improved, but the light output of the forward light is reduced
Solution Approach 1:
The patent applies local quality by differentiating the optical properties of the encapsulant in different regions: the first encapsulant layer contains light-absorbing particles to enhance contrast and reduce lateral light, while the second encapsulant layer is transparent to preserve forward light output. This spatial differentiation of material properties resolves the contradiction between contrast enhancement and light output maintenance.
2Length of stationary object
If the frame width is reduced to narrow gaps between displays, then the splicing gaps are minimized, but the safety distance is insufficient leading to potential damage from mutual pressing
Solution Approach 1:
The patent applies the nesting principle by placing the display panel within a recessed region of the housing, where the display panel is positioned below the top surface level. This nested configuration allows the frame to provide adequate safety distance and structural support while maintaining a narrow overall profile, resolving the contradiction between minimized splicing gaps and structural safety.
3Manufacturing precision
If sub-millimeter LEDs are used to achieve small pitch operations, then the pixel density is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the encapsulation function into two separate layers with distinct purposes: the first encapsulant layer focuses on light management (absorption and reflection) while the second encapsulant layer focuses on protection and light transmission. This segmentation of functional responsibilities simplifies the manufacturing process for small pitch LED arrays by decoupling optical optimization from structural protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves luminous efficiency and reduces splicing gaps, ensuring seamless display continuity and enhanced brightness without sacrificing contrast.
Implementation Method 1
The reflective layer is disposed on the substrate and between any two adjacent of the light emitting diode chips
Implementation Method 2
light-absorbing particles are added into the encapsulant. The light-absorbing particles can not only reduce the influence of the lateral light of the LED but also absorb the light source from outside to increase the contrast
Implementation Method 3
The light-transmitting layer is disposed on the pixel array, the reflective layer, and the light-absorbing layer
Data Source
AI summary
A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.