Stacked Pixel Chip Bonding Layout for Uniform Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photoelectric conversion apparatuses experience uneven heat transfer due to the unequal distribution of conductive members connecting pixel and electrical circuits, leading to inconsistent performance among pixel circuits.
Innovation Solution
The apparatus employs a configuration of metal bonding portions that include first and second metal bonding portions, with the second bonding portion connected to the semiconductor element layer but not overlapping with the pixel region, and a wiring pattern connected to multiple bonding portions, enhancing heat dissipation across the pixel region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conductive members are selectively disposed for a plurality of pixel circuits, then the number of conductive members is reduced, but uneven heat transfer occurs between pixel circuits with and without conductive members
Solution Approach 1:
The patent applies local quality by creating different types of metal bonding portions with distinct functions: first metal bonding portions connect pixel circuits to the second semiconductor element layer for heat dissipation, while second metal bonding portions connect only to the second semiconductor element layer to provide additional heat radiation paths. This localized functional differentiation resolves the heat transfer uniformity issue while maintaining a reduced number of conductive members.
Solution Approach 2:
The metal bonding portions serve multiple functions: electrical connection, heat dissipation, and heat radiation. By making the bonding portions multi-functional, the patent reduces the need for separate dedicated heat dissipation structures, thereby reducing overall device complexity while improving heat transfer uniformity through the second metal bonding portions that provide additional heat radiation paths.
2Temperature
If metal bonding portions are increased to improve heat dissipation, then heat transfer uniformity improves, but device complexity increases
Solution Approach 1:
The patent differentiates metal bonding portions into two types with specific local functions: first metal bonding portions for connecting pixel circuits and providing heat dissipation, and second metal bonding portions for connecting only to the second semiconductor element layer to provide additional heat radiation paths. This localized functional assignment improves heat dissipation efficiency without uniformly increasing the number of bonding portions across all pixel circuits.
Solution Approach 2:
The metal bonding portions are designed to perform multiple functions simultaneously: electrical signal transmission and heat dissipation/radiation. This multi-functionality allows the same structural elements to serve dual purposes, improving heat dissipation efficiency without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces uneven heat transfer and dark current, resulting in uniform output and improved performance across all pixel circuits.
Implementation Method 1
since a metal wiring has high thermal conductivity relative to an interlayer insulating film, a large amount of heat transfers in a conductive member
Data Source
AI summary
A photoelectric conversion apparatus includes a first chip having a first semiconductor element layer including a pixel region of a plurality of pixel circuits, and a second chip having a second semiconductor element layer. The first and second chips are bonded by a plurality of metal bonding portions between the first and second semiconductor element layers. The plurality of metal bonding portions includes first and second metal bonding portions disposed in a region overlapping with the pixel region in a plan view. The first metal bonding portion connects at least either one of the plurality of pixel circuits and the second semiconductor element layer. The second metal bonding portion is connected to at least either one of the plurality of pixel circuits and is not connected to the second semiconductor element layer in the region overlapping with the pixel region.