Pixel Structure With Crossed Interconnection Pattern For Micro LED Alignment

The patent applies preliminary action by pre-forming alignment marks and interconnection patterns on the substrate before transferring LED elements. The alignment marks are positioned in advance to guide the mass transfer process, ensuring that even though multiple LEDs are transferred simultaneously, each element can be accurately positioned relative to the pre-prepared interconnection patterns, thus maintaining both high efficiency and precision.

The patent applies local quality by creating localized alignment marks and interconnection patterns specifically at each LED element's target position. The interconnection patterns are designed with local features such as contact pads and alignment markers that are tailored to the small scale of individual micro-LED elements, enabling precise placement despite the small size and high density requirements.

The patent applies parameter changes by optimizing the geometric parameters of the interconnection patterns, such as line width, spacing, and contact area. The interconnection patterns are designed with specific dimensional parameters that control current distribution to compensate for process variations, thereby maintaining brightness uniformity while keeping the manufacturing process relatively simple.