Pixel Electrode Bridge Structure to Protect Lower Metal Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in protecting the lower metal layer during the etching process of the pixel electrode, which can lead to damage and performance issues.
Innovation Solution
The implementation of capping layers, specifically made of transparent conductive materials, is introduced to cover and protect the lower metal layers exposed during the etching process, preventing damage from etchants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pixel electrode is etched to form the display structure, then the pixel electrode pattern is created, but the lower metal layer exposed during etching is damaged by etchants
Solution Approach 1:
A capping layer comprising a transparent conductive material is introduced as an intermediary between the etchant and the lower metal layer. This capping layer is disposed on the lower metal layer before etching the pixel electrode, allowing the etching process to proceed while preventing etchant contact with the lower metal layer, thus resolving the contradiction between achieving precise pixel electrode patterning and maintaining lower metal layer integrity
Solution Approach 2:
The capping layer is applied in advance before the pixel electrode etching process. This preliminary action of depositing the transparent conductive material layer protects the lower metal layer from etchant exposure during subsequent etching steps, preventing damage while enabling precise pixel electrode formation
Data Source
AI summary
A display device includes a substrate including a display area and a non-display area, a pixel circuit portion disposed on the substrate and including a transistor that drives a pixel, and a display element portion disposed on the pixel circuit portion and including a pixel electrode electrically connected to an electrode of the transistor through a bridge pattern. The pixel circuit portion includes a first capping layer disposed between the bridge pattern and the pixel electrode, and the pixel electrode and the bridge pattern are multiple metal layers including a same material.