Pixel Electrode Contact Layout for Lower TFT Drain Resistance

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Solution Overview

Problem

Existing electronic devices face challenges in improving electron transfer between the pixel electrode and the drain, which affects display quality.

Innovation Solution

The electronic device includes a substrate, a thin film transistor, a first insulating layer, a pixel electrode, and a common electrode, where the pixel electrode is electrically connected to the transfer pad through the first opening of the first insulating layer, and the transfer pad is connected to the drain, increasing the contact area and reducing resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the contact area between pixel electrode and drain is increased, then electron transfer is improved, but device complexity increases due to additional transfer pad structure

Engineering Contradiction:
Improveelectron transferVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a transfer pad as an intermediary conductive layer between the pixel electrode and the drain. This transfer pad serves as a mediator that facilitates electron transfer by providing an extended contact area, thereby improving electrical connection without directly modifying the fundamental TFT structure excessively.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The transfer pad extends the contact area in the planar dimension (horizontal plane) rather than increasing vertical stacking. By expanding the interaction area between pixel electrode and drain in the lateral direction, the patent improves electron transfer pathways without significantly increasing device height or vertical complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the contact area between pixel electrode and transfer pad is increased, then resistance is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
ImproveresistanceVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The transfer pad is formed as a pre-established conductive structure before the pixel electrode is deposited. By preparing the transfer pad in advance with appropriate dimensions and position, the patent creates a robust foundation that tolerates subsequent alignment variations during pixel electrode formation, thereby reducing resistance without requiring extreme precision in later steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent optimizes the dimensional parameters of the transfer pad (such as its width, length, and thickness) to achieve an optimal balance between contact area and alignment tolerance. By carefully selecting these parameters, the transfer pad provides sufficient contact area to reduce resistance while maintaining reasonable manufacturing tolerances.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12266661B2Electronic device
Publication Date: 2025.04.01 INNOLUX CORP
  • US12266661B2 patent drawing
  • US12266661B2 patent drawing
  • US12266661B2 patent drawing

AI summary

An electronic device, including a substrate, a thin film transistor, a first insulating layer, a pixel electrode, and a common electrode, is provided. The thin film transistor is disposed on the substrate and includes an electrode. The first insulating layer is disposed on the thin film transistor and includes a first opening. The pixel electrode is disposed on the first insulating layer and electrically connected to the electrode through the first opening. The common electrode is disposed on the pixel electrode and in the first opening.