Pixel Electrode Layout for Uniform LED Laser Bonding
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Solution Overview
Problem
The manufacturing process of light-emitting diode display panels faces issues such as position deviation, rotation, and falling off of light-emitting diode elements due to temperature differences during laser bonding, which affects the yield of the panels.
Innovation Solution
A pixel structure design that includes a common electrode with intersecting portions and sub-pixel structures, where pad groups of adjacent sub-pixel structures are separated by these electrode portions, ensuring similar temperatures during bonding to mitigate temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser bonding technology is used to bond light-emitting diode elements to pad groups, then bonding efficiency and brightness are improved, but temperature differences cause position deviation, rotation, and falling off of elements
Solution Approach 1:
The patent introduces a common electrode structure as an intermediary thermal management component between the substrate and pad groups. This common electrode acts as a heat distribution mediator that receives heat from the substrate and redistributes it to the pad groups, reducing temperature differences during laser bonding and preventing position deviation and falling off of light-emitting diode elements
Solution Approach 2:
The patent changes the thermal parameters of the bonding system by introducing a common electrode with specific thermal conductivity properties. This parameter change enables better heat distribution across the pad groups, maintaining more uniform temperatures during laser bonding and improving position accuracy without sacrificing bonding efficiency
2Productivity
If laser bonding is performed on multiple pad groups simultaneously, then productivity increases, but temperature differences among pad groups increase causing bonding defects
Solution Approach 1:
The common electrode serves as a thermal intermediary that couples the substrate to multiple pad groups simultaneously. During parallel bonding operations, it mediates heat distribution across all pad groups, ensuring uniform temperature rise even when multiple elements are bonded at the same time, thus maintaining temperature uniformity while increasing productivity
Solution Approach 2:
The common electrode creates a thermal equipotential condition across the pad groups by providing a low-resistance heat distribution path. This ensures that all pad groups reach similar temperatures during simultaneous laser bonding, eliminating temperature gradients that would otherwise cause bonding defects when multiple pad groups are processed in parallel
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the bonding yield by reducing temperature variations among pad groups, thereby minimizing issues like position deviation and falling off of light-emitting elements.
Implementation Method 1
there is a temperature difference between the pad groups of the pixel structures. When the temperature difference is too large, the light-emitting diode elements are prone to problems such as position deviation, rotation, and falling off
Data Source
AI summary
A pixel structure includes a common electrode and sub-pixel structures. The common electrode includes a first common electrode portion and a second common electrode portion that cross each other. Each of the sub-pixel structures includes a pad group and a light-emitting element. The pad group at least includes a first pad. The light-emitting element is bonded to the pad group. The sub-pixel structures include a first sub-pixel structure, a second sub-pixel structure and a third sub-pixel structure. In a top view of the pixel structure, the pad group of the first sub-pixel structure and the pad group of the second sub-pixel structure are separated by the first common electrode portion, and the pad group of the second sub-pixel structure and the pad group of the third sub-pixel structure are separated by the second common electrode portion. In addition, another pixel structure is also provided.