Buried-Chip Pixel Package for Uniform LED Light Emission
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Solution Overview
Problem
Conventional pixel packages with control chips obstruct light emission from light-emitting diodes, leading to image quality degradation and poor viewing experiences due to light pattern deviation.
Innovation Solution
A pixel package design featuring a base material with a buried circuit structure, light-emitting semiconductor elements, and a non-light-emitting semiconductor element, where the non-light-emitting semiconductor element is embedded within the base material and connected to the circuit layers, and a light-transmitting adhesive layer covers the light-emitting elements, ensuring even light transmission and minimizing obstruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a control chip is disposed on the circuit board to control the light-emitting diodes, then the pixel package can control the operation of light-emitting elements, but the control chip blocks the light emitted from the light-emitting diodes causing light pattern deviation
Solution Approach 1:
The control chip is rotated 90 degrees so that its long side is perpendicular to the light emission direction. This dimensional reorientation allows the light-emitting diodes to be positioned such that their light emission paths do not pass through the control chip, eliminating light blocking while maintaining control functionality.
Solution Approach 2:
The patent employs asymmetric arrangement where the light-emitting diodes are positioned at corners or edges of the circuit board rather than symmetrically around the control chip. This asymmetric positioning ensures that light emission paths are optimized to avoid the control chip, resolving the contradiction between control functionality and light emission uniformity.
2Adaptability or versatility
If the control chip covers a large area relative to the light-emitting diodes, then comprehensive control functions can be integrated, but the light pattern deviates to one side due to obstruction
Solution Approach 1:
By rotating the control chip 90 degrees and repositioning the light-emitting diodes accordingly, the patent achieves both comprehensive control function integration and precise light pattern alignment. The dimensional change allows the control chip to occupy necessary area for control functions without obstructing light paths.
Solution Approach 2:
The patent applies local quality optimization by positioning light-emitting diodes at specific locations (corners or edges) where they can emit light without obstruction. This localized positioning strategy ensures that areas critical for light emission are free from control chip obstruction while maintaining overall control functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform light emission, enhancing image quality and providing a better viewing experience by preventing light pattern deviation and improving the alignment of light emission from the pixel package.
Implementation Method 1
a light-transmitting adhesive layer covers the plurality of light-emitting semiconductor elements and is in direct contact with the base material
Data Source
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AI summary
A pixel package includes a base material, a circuit structure, a plurality of light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, a plurality of bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base.