Pixel Through-Hole Organic Layer Layout for Higher Aperture Ratio
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Solution Overview
Problem
Existing electronic devices face challenges in increasing the aperture ratio of pixels and improving process yield while maintaining display quality, particularly in terms of contrast and transmittance.
Innovation Solution
The electronic device incorporates a first organic layer with a through-hole between the drain electrode and the transparent conductive layer, and a second organic layer disposed within the through-hole, configured to enhance performance without affecting the pixel aperture ratio, along with a manufacturing method that improves yield and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution increases and the pixel area decreases, then the display quality improves, but the aperture ratio of the pixel decreases
Solution Approach 1:
The patent divides the pixel structure into multiple functional layers (first organic layer, second organic layer, conductive layer, photoresist element) with a through-hole configuration. This segmentation allows the light-emitting area to be optimized independently from the overall pixel area, maintaining high aperture ratio even as pixel dimensions decrease for higher resolution displays.
Solution Approach 2:
The patent introduces a vertical dimension by creating a through-hole that penetrates through the first organic layer and extends into the second organic layer. This three-dimensional structure allows light to pass through the pixel aperture more efficiently, improving the aperture ratio without increasing the horizontal pixel area, thus resolving the contradiction between high resolution and aperture ratio.
2Area of stationary object
If the aperture ratio is increased, then the transmittance improves, but the process yield decreases
Solution Approach 1:
The patent employs a photoresist element disposed on the second organic layer that preliminarily defines the through-hole structure before final processing. This preliminary action allows for precise control of the aperture geometry, enabling high aperture ratios to be achieved while maintaining manufacturing precision and process yield through controlled fabrication steps.
Solution Approach 2:
The patent optimizes the parameters of the organic layers and through-hole structure to achieve the desired aperture ratio. By carefully controlling the thickness, material composition, and geometric parameters of each layer, the patent achieves high transmittance while maintaining manufacturability and process yield through parameter optimization rather than extreme structural modifications.
3Measurement precision
If the pixel area decreases, then the resolution improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the pixel structure into distinct functional layers with clear interfaces and boundaries. This segmentation simplifies the manufacturing process by allowing each layer to be fabricated and controlled independently, reducing the cumulative precision requirements that would arise from attempting to fabricate the entire pixel structure as a single integrated component.
Solution Approach 2:
The patent introduces the photoresist element as an intermediary component that facilitates precise patterning and alignment during manufacturing. This intermediary layer serves as a template or mask that guides subsequent fabrication steps, enabling high precision to be achieved through controlled intermediate processes rather than requiring extreme precision in all manufacturing steps simultaneously.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a thin-film transistor, a first organic layer, a conductive layer, a second organic layer and a photoresist element. The thin-film transistor is disposed on the substrate. The first organic layer is disposed on the thin-film transistor and has a through-hole. The conductive layer is disposed on the first organic layer and electrically connected to the thin-film transistor through the through-hole. The second organic layer includes a first portion and a second portion. The first portion of the second organic layer is disposed in the through-hole, and the second portion of the second organic layer covers at least a portion of a flat portion of an upper surface of the first organic layer. The photoresist element is disposed on the second organic layer.