Pixelized Electron Detection for Fast 3D Defect Inspection
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Solution Overview
Problem
Conventional charged particle beam inspection systems have limited capability to capture detailed information about small IC structures, leading to reduced inspection speed and efficiency in detecting defects, as they rely on overall signal electron detection without spatial distribution analysis.
Innovation Solution
The implementation of a pixelized or segmented electron detector with multiple pixels or detection segments arranged in a grid pattern, capable of generating detection signals that provide spatial distribution information of signal electrons, allowing for improved topographical characterization and defect identification within the sample.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional overall signal electron detection is used, then device complexity is reduced, but measurement precision deteriorates due to inability to capture spatial distribution information
Solution Approach 1:
The electron detector is divided into multiple pixels or detection segments arranged in a grid pattern, where each segment independently detects signal electrons from specific spatial regions. This segmentation enables capture of spatial distribution information while maintaining manageable device complexity through modular architecture.
2Measurement precision
If detailed spatial distribution analysis is implemented, then measurement precision is improved, but inspection speed deteriorates due to increased data processing requirements
Solution Approach 1:
By segmenting the detector into multiple pixels, spatial distribution information is captured simultaneously across all regions during a single scan, rather than requiring sequential analysis. This parallel detection approach maintains inspection speed while enabling detailed topographical characterization through the spatial patterns detected across the pixel array.
3Measurement precision
If pixelized electron detector with multiple pixels is used, then measurement precision is improved for detecting small structures, but device complexity increases
Solution Approach 1:
The detector is segmented into multiple pixels arranged in a grid, with each pixel independently detecting signal electrons from its corresponding spatial region. This segmentation provides detailed spatial information necessary for detecting small IC structures while using standard pixel array technology to keep device complexity manageable.
Solution Approach 2:
The detector transitions from a single integrated detection area to a two-dimensional pixel array, adding spatial dimensionality to the detection capability. This dimensional change enables precise localization of signal electrons across the sample surface, improving detection of small structures without requiring multiple separate detectors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the detection of small structural defects without reducing inspection speed, providing three-dimensional information of buried structures and enhancing the overall throughput of the inspection process.
Implementation Method 1
receiving signal electrons by the multiple pixels of the pixelized electron detector, wherein the signal electrons are generated in response to an incidence of an emitted charged particle beam onto the sample
Data Source
AI summary
A charged particle beam apparatus for inspecting a sample is provided. The apparatus includes a pixelized electron detector to receive signal electrons generated in response to an incidence of an emitted charged particle beam onto the sample. The pixelized electron detector includes multiple pixels arranged in a grid pattern. The multiple pixels may be configured to generate multiple detection signals, wherein each detection signal corresponds to the signal electrons received by a corresponding pixel of the pixelized electron detector. The apparatus further includes a controller includes circuitry configured to determine a topographical characteristic of a structure within the sample based on the detection signals generated by the multiple pixels, and identifying a defect within the sample based on the topographical characteristic of the structure of the sample.