Placing Table Cooling Paths for Wafer Edge Temperature Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in precisely controlling the temperature of the outermost portion of a substrate, particularly when the substrate has a diameter equal to or larger than 300 mm.
Innovation Solution
The placing table includes a first path formed at an outer side than the substrate and a second path under the substrate, with the first path having a smaller cross-sectional area than the second path to increase coolant flow velocity and enhance local temperature control of the substrate's outermost portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single cooling path is used under the substrate, then the overall substrate temperature can be controlled, but the temperature of the outermost portion cannot be precisely controlled
Solution Approach 1:
The cooling path is divided into two distinct segments: a first cooling path extending from the center toward the outer peripheral portion, and a second cooling path located at the outer peripheral portion. This segmentation allows independent temperature control of different substrate regions, enabling precise control of the outermost portion temperature while maintaining overall thermal management.
Solution Approach 2:
The cooling system provides different cooling characteristics to different regions: the first cooling path addresses the central and intermediate regions, while the second cooling path specifically targets the outer peripheral portion. This local differentiation enables precise temperature control where needed (outermost portion) without over-complicating the entire cooling system.
2Measurement precision
If coolant flow velocity is increased to enhance cooling efficiency, then temperature control accuracy improves, but energy loss increases
Solution Approach 1:
The first cooling path has a smaller cross-sectional area than the second cooling path, creating localized high-velocity flow precisely where temperature control is most critical (toward the outer peripheral portion). The second path with larger cross-section maintains adequate flow with lower energy consumption for the remaining cooling requirements, optimizing the balance between cooling efficiency and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved temperature control of the substrate's outermost portion, enhancing accuracy and productivity by effectively managing heat removal and distribution.
Implementation Method 1
a coolant controlled to a preset temperature is flown into a path provided within the placing table to thereby cool the substrate
Implementation Method 2
a coolant controlled to a preset temperature is flown into a path provided within the placing table to thereby cool the substrate
Data Source
AI summary
A placing table includes a first surface located at an outer side than a substrate; and a second surface on which the substrate is placed. A first path is formed to correspond to the first surface.