Planar Conductive Connection Segmentation for Oscillation Suppression
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Solution Overview
Problem
Semiconductor devices with multiple semiconductor chips face issues with oscillation and noise in voltages and currents, which existing technologies have not effectively addressed.
Innovation Solution
The semiconductor device incorporates planar conductive connection portions with path restriction features, such as slits, arranged to restrict current paths and manage current directions differently between connection portions, reducing mutual electromagnetic induction and oscillation noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If planar conductive connection portions are used to connect circuit portions, then electrical connectivity is achieved, but oscillation and noise occur due to uncontrolled current paths
Solution Approach 1:
The connection portion is segmented by introducing slits that divide the conductive material into multiple regions. These slits create separate current paths that restrict electromagnetic induction between adjacent circuit portions, thereby reducing oscillation and noise while maintaining electrical connectivity.
Solution Approach 2:
Different regions of the connection portion are given different properties through the slits. The areas between slits have restricted current paths with specific resistance characteristics, while other areas maintain lower resistance. This local differentiation allows current to flow preferentially through controlled paths, suppressing oscillation and noise generation.
2Object-generated harmful factors
If current paths are restricted using slits in connection portions, then oscillation and noise are suppressed, but current flow resistance increases
Solution Approach 1:
Instead of completely blocking current paths with slits, the invention applies partial restriction by using slits that create localized resistance increases only in specific directions. The slits are positioned and dimensioned to provide sufficient restriction for suppressing oscillation and noise, while allowing adequate current flow through alternative paths within the same connection portion.
3Reliability
If multiple connection portions are arranged with main surfaces facing each other, then circuit connectivity is improved, but mutual electromagnetic induction increases causing oscillation
Solution Approach 1:
Each connection portion is segmented by slits into multiple isolated regions when viewed from the top. This segmentation prevents continuous current loops between opposing connection portions, thereby reducing mutual electromagnetic induction while maintaining vertical connectivity between circuit portions.
Solution Approach 2:
The slits are arranged asymmetrically within each connection portion, creating non-uniform current distribution patterns. This asymmetry disrupts the symmetry of electromagnetic fields between opposing connection portions, reducing mutual induction effects that would otherwise cause oscillation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses oscillation and noise in voltages and currents by managing current paths and directions, improving the stability and efficiency of semiconductor devices.
Implementation Method 1
Directions of currents flowing through the current paths between the path restriction portions and the circuit connection ends may be different in the first connection portion and the second connection portion
Implementation Method 2
For each of the first connection portion and the second connection portion, the circuit connection ends and the path restriction portions may be arranged such that at least a portion of the current circulates around the path restriction portions
Data Source
AI summary
A semiconductor device is provided, comprising a plurality of circuit portions, and a first connection portion and a second connection portion that are formed of planar conductive materials and connected to any of the circuit portions, wherein the first connection portion and the second connection portion are arranged with respective main surfaces facing each other, the first connection portion and the second connection portion each comprising a circuit connection end connected to the circuit portions, a path restriction portion for restricting a current path in the main surface, directions of currents flowing through the current paths between the path restriction portions and the circuit connection ends are different in the first connection portion and the second connection portion. Directions of currents flowing through the current paths between the path restriction portions and the circuit connection ends are preferably different in the first connection portion and the second connection portion.