Conversion Constructional Details TRIZ Cases
- Parallel Diode Current Distribution via Parasitic Inductance
Varied parasitic inductance distributes current evenly across parallel diodes, preventing abnormal heat generation from manufacturing differences.
- Three-level high-power module combined electrode design
Parallel facing electrode arrangement minimizes current loop areas to reduce stray inductance and power losses in three-level high-power modules.
- Power Converter PCB Layout for Inductance Balancing
Stacked gate wiring suppresses current unbalancing while preventing substrate size expansion.
- Power Conversion Device Noise Reduction via Capacitor Overlap
Smoothing capacitors overlap rectification elements on a control substrate to lower noise impedance, reducing vibration damage and manufacturing costs.
- Reverse Conductive Switches in Modular Converter Submodules
A modular multilevel converter submodule uses reverse conductive power semiconductor switches in its bridging branch to lower on-state losses during normal operation.
- Power Converter Bus Bar Thermal Management
Extending member conducts heat away from capacitor element to housing surface, preventing temperature-related deterioration and short-circuits.
- Triangular Semiconductor Module Arrangement for Balanced Short-Circuit Current
An asymmetric triangular layout balances parasitic inductance across current paths, resolving unbalanced short-circuit currents during switching failures.
- Power Conversion Apparatus Thermal Coupling via Insulated Sheet
A power conversion apparatus couples power devices to housing walls using insulated heat-conducting sheets and elastic clamps.
- Power Converter Layout for Surge Suppression
Integrated power converter design merges driver and power modules to minimize stray inductance.
- Integrated Multi-Port Power Converter with Breaker Relay
An integrated power converter merges breaker and relay functions into one unit, reducing device complexity while maintaining circuit protection reliability.
- Semiconductor Device Self-Inductance Reduction
A semiconductor device structure minimizes internal wiring self-inductance through optimized multi-layer conductor arrangements.
- Power Module Intermediate Electrode for Collector Sense Accuracy
A power module uses an intermediate electrode to connect conductors and position collector sense wiring away from high-current areas.
- Modular Power Supply With Segmented Access Zones
A modular power supply uses a hinged cover and partition to isolate primary input circuitry from user-accessible output modules.
- Planar Conductive Connection Segmentation for Oscillation Suppression
Segmented planar conductive connection portions restrict current paths to manage electromagnetic induction between circuit regions.
- Embedded Charge Pumps for On-Die Power Regulation
On-die embedded charge pumps eliminate routing parasitics to resolve voltage droop during high current load steps.
- Two-Layer Laminated Busbar for NPC Power Converter
Segmented upper and lower layers provide mirror symmetry to minimize voltage stress on semiconductor components.
- Half-bridge Switch Arrangement with Vertical Busbar Stacking
Vertical busbar stacking reduces intermediate circuit inductance while parallel semiconductor elements manage high current levels.
- Power Converter Voltage Division for Vibration Resistance
Segmenting the voltage dividing circuit allows independent impedance adjustment while maintaining mechanical strength against vibrations.
- IGBT Cosmic Ray Failure Mitigation via Thermal Control
Dynamic thermal management increases IGBT temperature during low-power states to mitigate cosmic ray susceptibility while preserving operational efficiency.
- Flat Busbar System for Low-Inductive Power Converter Connections
Parallel metal bodies with insulating layers reduce inductance while increasing current-carrying capacity between converter assemblies.
- Power Semiconductor Device Stray Capacitance Balancing
Adjusting electrode on heatsink balances stray capacitances to reduce parasitic inductance and noise.
- IGBT Load Controller Double-Sided Cooling and Compact Layout
Double-sided cooling via heat-dissipating fins resolves low efficiency from single-sided contact while compact layout reduces space occupation.
- Power Semiconductor Module with Isolated Explosion Chambers
A power semiconductor module uses partition walls to isolate devices within separate chambers.