Power Converter Layout for Surge Suppression
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Solution Overview
Problem
High-speed switching in power converters for hybrid automobile systems leads to increased surge voltage, which causes gate current oscillation and noise, potentially damaging power semiconductor devices due to leakage currents and high stray capacitance and inductance.
Innovation Solution
A power converter design with a power module and driver module configuration, where high and low potential side semiconductor devices are connected in series, and wiring patterns are arranged to minimize inductance and maximize noise resistance by opposing current flows and using a power source transformer to control gate current, reducing leakage currents and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If high-speed switching is implemented to reduce losses, then fuel efficiency improves, but surge voltage increases causing gate current oscillation and potential device breakdown
Solution Approach 1:
A clamp circuit is introduced as an intermediary component between the power semiconductor device and the noise source. The clamp circuit includes a capacitor connected in parallel with the power semiconductor device and a resistor connected in series with the capacitor, forming a voltage clamping mechanism that suppresses surge voltage and gate current oscillation during high-speed switching operations
Solution Approach 2:
The clamp circuit is designed to preemptively counteract the harmful effects of surge voltage before it can cause gate current oscillation and device breakdown. By positioning the clamp circuit directly across the power semiconductor device, it provides preliminary protection against voltage spikes that would otherwise propagate through the system
2Object-affected harmful factors
If wiring length is reduced to lower stray capacitance and inductance, then noise resistance improves, but device complexity increases due to compact layout constraints
Solution Approach 1:
The driver module and power module are merged into a single integrated housing, with the clamp circuit components (capacitor and resistor) positioned within the same housing as the power semiconductor device. This merging eliminates the need for external wiring connections, thereby reducing stray capacitance and inductance while managing layout complexity through integrated design
Solution Approach 2:
The housing serves multiple functions: it provides mechanical support for the power semiconductor device, houses the clamp circuit components, provides electrical insulation, and facilitates heat dissipation. This multi-functionality reduces the need for separate components and simplifies the overall system layout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces losses and improves noise resistance, preventing accidental activation of power semiconductor devices and enhancing reliability by minimizing voltage surges and leakage currents.
Implementation Method 1
a power source transformer as a circuit provided on the driver module to convert a signal voltage for controlling the supply and cutoff of the main current into voltage applied to a control electrode of the high potential side semiconductor device and a control electrode of the low potential side semiconductor device
Implementation Method 2
conductors disposed in the vicinity of the plane on which the plural power module side wirings are provided and in the vicinity of the plane on which the plural driver module side wirings are provided, and electrically connected in such positions as to surround magnetic flux generated by current looping at least through the power source transformer, the driver module side wirings, and the power module side wirings
Data Source
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AI summary
A power converter which has a power module allowing supply and cutoff of main current, and a driver module controlling supply and cutoff of the main current allowed by the power module includes: a high potential side semiconductor device which allows supply and cutoff of the main current on the high potential side of the power module; a low potential side semiconductor device which allows supply and cutoff of the main current on the low potential side of the power module, and is connected with the high potential side semiconductor device in series; plural power module side wirings connected with respective electrodes contained in the high potential side semiconductor device and the low potential side semiconductor device, and disposed adjacent to each other substantially on the same plane as the power module in the order of applied potentials with a connection end between the plural power module side wirings and the driver module located along the end of the power module; plural driver module side wirings provided on the driver module as wirings connected with the plural corresponding power module side wirings, and disposed adjacent to each other substantially on the same plane as the driver module in the order corresponding to the positions of the plural power module side wirings in positions along the end of the driver module; a power source transformer as a circuit which converts a signal voltage for controlling the supply and cutoff of the main current by the driver module into voltage applied to a control electrode of the high potential side semiconductor device and a control electrode of the low potential side semiconductor device, plural terminals of the power source transformer in correspondence with the plural driver module side wirings being provided in the order of the positions of the plural corresponding driver module side wirings; and conductors disposed in the vicinity of the plane on which the plural power module side wirings are provided and in the vicinity of the plane on which the plural driver module side wirings are provided, and electrically connected in such positions as to surround magnetic flux generated by current looping at least through the power source transformer, the driver module side wirings, and the power module side wirings.